Footwear Having Sensor System

ABSTRACT

A sensor system is adapted for use with an article of footwear and includes an insert member including a first layer and a second layer, a port connected to the insert and configured for communication with an electronic module, a plurality of force and/or pressure sensors on the insert member, and a plurality of leads connecting the sensors to the port.

CROSS-REFERENCE TO RELATED APPLICATION

This application is a continuation of, and claims priority to,co-pending U.S. patent application Ser. No. 13/401,918, filed Feb. 22,2012, which prior application is incorporated herein by reference in itsentirety and made part hereof.

TECHNICAL FIELD

The present invention generally relates to footwear having a sensorsystem and, more particularly, to a shoe having a force and/or pressuresensor assembly operably connected to a communication port located inthe shoe.

BACKGROUND

Shoes having sensor systems incorporated therein are known. Sensorsystems collect performance data wherein the data can be accessed forlater use such as for analysis purposes. In certain systems, the sensorsystems are complex or data can only be accessed or used with certainoperating systems. Thus, uses for the collected data can beunnecessarily limited. Accordingly, while certain shoes having sensorsystems provide a number of advantageous features, they neverthelesshave certain limitations. The present invention seeks to overcomecertain of these limitations and other drawbacks of the prior art, andto provide new features not heretofore available.

BRIEF SUMMARY

The present invention relates generally to footwear having a sensorsystem. Aspects of the invention relate to an article of footwear thatincludes an upper member and a sole structure, with a sensor systemconnected to the sole structure. The sensor system includes a pluralityof sensors that are configured for detecting forces and/or pressureexerted by a user's foot on the sensor.

Aspects of the invention relate to a sensor system adapted for use withan article of footwear. The sensor system includes an insert memberconfigured to be inserted into a foot-receiving chamber of an article offootwear, the insert member including a first layer and a second layer,a port connected to the insert and configured for communication with anelectronic module, a plurality of force and/or pressure sensors on theinsert member, and a plurality of leads connecting the sensors to theport.

The system may also include a pathway providing electrical communicationbetween the first and second layers. The system may further include ahousing connected to the insert and configured to support the electronicmodule in communication with the port. The insert may further include atleast one additional layer, such as a spacer layer having holes alignedwith the sensors and/or the pathway to permit engagement of suchcomponents through the spacer layer.

According to one aspect, the sensor system includes a first resistorlocated on the first layer and a second resistor located on the secondlayer, each connected to one or more of the leads. The port, thepathway, the sensors, the leads, and the first and second resistors forma circuit on the insert member, and the circuit is configured to have avoltage applied between a first terminal and a ground located at theport. The first and second resistors are arranged in parallel betweenthe first terminal and the ground. Each of the resistors may include aninner section connected to a first lead, an outer section connected to asecond lead, and a bridge extending between the inner section and theouter section and partially overlapping both the inner section and theouter section, wherein the resistor is configured such that anelectronic signal can pass between the first lead and the second leadthrough the inner section, the bridge, and the outer section.

According to another aspect, the pathway may further include asubstantially annular stiffener positioned around the pathway on atleast one of the first and second layers, wherein the stiffener hasdecreased flexibility compared to the pathway. The pathway mayadditionally or alternately include a first conductive portion on thefirst layer and a second conductive portion on the second layer, whereinthe first and second conductive portions are in continuous engagementwith each other through the hole to provide electrical communicationbetween the first and second layers, with the first and secondconductive portions each having a gap extending therethrough anddividing the first and second conductive portions into separate firstand second sections. In this configuration, the gap may be elongated andaligned substantially perpendicular to a virtual line extending betweena front edge of the first metatarsophalangeal sensor and a rear edge ofthe fourth metatarsophalangeal sensor. The pathway in this configurationmay constitute two separate pathways, on opposite sides of the gap.

According to another aspect, the spacer layer may include a first holealigned with one of the sensors to permit at least partial engagementbetween the first and second contacts of the sensor through the spacerlayer, and may further include a channel extending from the hole to avent in the insert member, wherein the channel permits air to flowbetween the first and second layers from the sensor to an exterior ofthe insert member, through the first vent. The vent may have aselectively permeable closure member positioned to cover the vent.Additionally, the vent may be connected to more than one sensor throughadditional channels, and/or the insert may contain a second ventconnected to one or more sensors in a similar arrangement. An article offootwear incorporating the insert may include a cavity within a solemember of the footwear that is located at least partially below thevent. The cavity extends laterally from the vent to a distal end locatedoutside a peripheral boundary of the insert, such that the cavity isconfigured to permit the air exiting the first vent to pass away fromthe insert member. Further, a patch of dielectric material may beconnected to one of the first and second layers and may extend acrossthe channel to be positioned between the first and second layers,resisting shorting of one or more conductive members between the firstand second layers through the channel.

According to a further aspect, the insert may include an extensionextending into the well and consolidating the ends of the leads to formthe interface, the extension having a strip of reinforcing materialextending across the ends of the leads. The extension has a bend areawhere the extension bends downwardly at or near a peripheral edge of thehousing and a depending portion that extends downwardly from the bendarea into the well. In this configuration, the interface is located onthe depending portion within the well, and the strip extendstransversely across the bend area to provide reinforcement and wearresistance to the bend area. The system may also contain an interfaceassembly that includes a base member and a plurality of electricalconnectors supported by the base member, where at least a portion of thedepending portion is received in the base member and the ends of theleads engage the electrical connectors to form the interface.

According to yet another aspect, the insert includes a first cut-out ona medial edge of the insert member and a second cut-out on a lateraledge of the insert member, proximate a juncture between the forefootportion and the midfoot portion. A width of the insert defined betweenthe medial and lateral edges is larger in the midfoot portion than thewidth measured between the first and second cut-outs and the widthmeasured at the heel portion. The insert may also include a hole in themidfoot portion configured to receive the housing, and the hole may makeup less than half the width of the midfoot portion. The insert may alsoinclude other cut-out portions.

Other aspects of the invention relate to sensor systems that includevarious combinations of the above-discussed features.

Further aspects of the invention relate to a system that includes anarticle of footwear with a sensor system as described above, with anelectronic module connected to the sensor system, and an external deviceconfigured for communication with the electronic module. The module isconfigured to receive data from the sensors and to transmit the data tothe external device, and the external device is configured for furtherprocessing the data.

According to one aspect, the system also includes an accessory deviceconnected to the external device, configured to enable communicationbetween the electronic module and the external device. The accessorydevice may also be configured for connection to a second external deviceto enable communication between the electronic module and the secondexternal device.

Still other features and advantages of the invention will be apparentfrom the following specification taken in conjunction with the followingdrawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a side view of a shoe;

FIG. 2 is an opposed side view of the shoe of FIG. 1;

FIG. 3 is a top perspective view of a sole of a shoe (having a shoeupper removed and a foot contacting member folded aside) incorporatingone embodiment of a sensor system according to aspects of the presentinvention;

FIG. 4 is a top perspective view of the sole and the sensor system ofFIG. 3, with a foot contacting member of the shoe removed and anelectronic module removed;

FIG. 5 is a top perspective view of the sole of FIG. 3, with the footcontacting member of the shoe removed and without the sensor system;

FIG. 6 is a schematic diagram of one embodiment of an electronic modulecapable of use with a sensor system, in communication with an externalelectronic device;

FIG. 7 is a top view of an insert of the sensor system of FIG. 3,adapted to be positioned within the sole structure of an article offootwear for a user's right foot;

FIG. 8 is a top perspective view of the insert of FIG. 7;

FIG. 9 is a top view of the sensor system of FIG. 3, including theinsert of FIG. 7;

FIG. 10 is a top perspective view of the sensor system of FIG. 9;

FIG. 11 is a magnified top view of a portion of the sensor system ofFIG. 9;

FIG. 12 is a top view of the sensor system of FIG. 9 and a similarsensor system adapted for use in the sole structure of an article offootwear for a user's left foot;

FIG. 13 is an exploded perspective view of the insert of FIG. 7, showingfour different layers;

FIG. 14 is a top view of a first layer of the insert of FIG. 13;

FIG. 15 is a magnified top view of a portion of the first layer of FIG.14;

FIG. 16 is a top view of a second layer of the insert of FIG. 13;

FIG. 17 is a magnified top view of a portion of the second layer of FIG.16;

FIG. 18 is a top view of a spacer layer of the insert of FIG. 13;

FIG. 19 is a top view of a bottom layer of the insert of FIG. 13;

FIG. 20 is a schematic circuit diagram illustrating one embodiment of acircuit formed by the components of the sensor system of FIG. 9;

FIG. 21 is magnified cross-sectional view schematically illustrating thearea indicated by lines 21-21 in FIG. 11;

FIG. 22A is a bottom view of the sensor system of FIG. 9;

FIG. 22B is a bottom view of the sensor system as illustrated in FIG.22A, having filters connected over vents in the sensor system;

FIG. 22C is a top view of a spacer layer of another embodiment of aninsert for a sensor system according to aspects of the presentinvention, with broken lines showing positions of sensors;

FIG. 22D is a bottom view of an insert for a sensor system incorporatingthe spacer layer of FIG. 22C, with broken lines showing positions offilters connected to insert;

FIG. 23 is a schematic diagram of the electronic module of FIG. 6, incommunication with an external gaming device;

FIG. 24 is a schematic diagram of a pair of shoes, each containing asensor system, in a mesh communication mode with an external device;

FIG. 25 is a schematic diagram of a pair of shoes, each containing asensor system, in a “daisy chain” communication mode with an externaldevice;

FIG. 26 is a schematic diagram of a pair of shoes, each containing asensor system, in an independent communication mode with an externaldevice;

FIG. 27 is a plot showing pressure vs. resistance for one embodiment ofa sensor according to aspects of the present invention;

FIG. 28 is a schematic cross-sectional view of a portion of the sole andsensor system of FIG. 4;

FIG. 29 is a schematic cross-sectional view of a portion of anotherembodiment of a sole and sensor system according to aspects of thepresent invention;

FIG. 30 is a top view of the sole of FIG. 3 with the foot contactingmember in operational position;

FIG. 31 is a cross-sectional view schematically depicting the view takenalong lines 31-31 of FIG. 10;

FIG. 32 is a cross-sectional view schematically depicting the view takenalong lines 32-32 of FIG. 10;

FIG. 33 is an exploded perspective view of another embodiment of asensor system according to aspects of the present invention;

FIG. 34 is an exploded perspective view of another embodiment of asensor system according to aspects of the present invention;

FIGS. 35A and 35B are schematic cross-sectional views of a sensor of thesensor system of FIG. 7;

FIG. 36 is a top perspective view of a sole of a shoe (having a shoeupper removed and a foot contacting member folded aside) incorporatinganother embodiment of a sensor system according to aspects of thepresent invention;

FIG. 37 is a top perspective view of the sole of FIG. 36, with the footcontacting member of the shoe removed and without the sensor system;

FIG. 38 is a top perspective view of the sole and the sensor system ofFIG. 36, with a foot contacting member of the shoe removed and anelectronic module removed;

FIG. 39 is a top view of an insert of the sensor system of FIG. 36,adapted to be positioned within the sole structure of an article offootwear for a user's right foot;

FIG. 40 is a top view of a first layer of the insert of FIG. 39;

FIG. 41 is a top view of a second layer of the insert of FIG. 39;

FIG. 42 is a top view of a spacer layer of the insert of FIG. 39;

FIG. 43 is a top view of a bottom layer of the insert of FIG. 39;

FIG. 44 is an exploded perspective view of the insert of FIG. 39,showing four different layers;

FIG. 45 is a top perspective view of a sole of a shoe (having a shoeupper removed and a foot contacting member folded aside) incorporatinganother embodiment of a sensor system according to aspects of thepresent invention;

FIG. 46 is a top perspective view of the sole of FIG. 45, with the footcontacting member of the shoe removed and without the sensor system;

FIG. 47 is a top perspective view of the sole and the sensor system ofFIG. 45, with a foot contacting member of the shoe removed and anelectronic module removed;

FIG. 48 is a top view of another embodiment of an insert of the sensorsystem adapted to be positioned within the sole structure of an articleof footwear for a user's right foot, according to aspects of the presentinvention;

FIG. 49 is a top view of a first layer of the insert of FIG. 48;

FIG. 50 is a top view of a spacer layer of the insert of FIG. 48;

FIG. 51 is a top view of a second layer of the insert of FIG. 48;

FIG. 52 is a top view of another embodiment of an insert of a sensorsystem according to aspects of the present invention;

FIG. 53 is a top view of a first layer of the insert of FIG. 52;

FIG. 54 is a top view of a spacer layer of the insert of FIG. 52;

FIG. 55 is a top view of a second layer of the insert of FIG. 52;

FIG. 56 is a cross-sectional view taken along lines 56-56 in FIG. 52;

FIG. 57 is a schematic cross-sectional view illustrating one embodimentof a method and equipment for forming a well in a sole structure of anarticle of footwear, according to aspects of the present invention;

FIG. 58 is a schematic cross-sectional view illustrating the solestructure of the article of footwear of FIG. 57 with an insert member ofa sensor system and a foot contacting member connected thereto;

FIG. 59 is a schematic cross-sectional view illustrating anotherembodiment of a sensor system positioned within a sole structure of anarticle of footwear, according to aspects of the present invention;

FIG. 59A is a schematic cross-sectional view illustrating anotherembodiment of a sensor system positioned within a sole structure of anarticle of footwear, according to aspects of the present invention;

FIG. 60 is a perspective view of one embodiment of a foot contactingmember configured for use with a sensor system according to aspects ofthe present invention;

FIG. 61 is a perspective view of another embodiment of a sensor systemaccording to aspects of the present invention;

FIGS. 62-64 illustrate a plan view and perspective views of the port inthe insert member according to aspects of the invention;

FIGS. 65-67 illustrate components of a housing of the port;

FIGS. 68-71 illustrate views of an interface assembly used in the port;

FIGS. 72-73 illustrate views of the interface assembly operablyconnected to the insert member;

FIG. 74 is a partial enlarged plan view of the port connected to theinsert member and having a cover member removed;

FIGS. 75-76 are side elevation views of the port attached to the insertmember;

FIGS. 77-78 are additional views of the module according to aspects ofthe invention;

FIGS. 79-80 are perspective views of contacts and a module carrieraccording to aspects of the invention;

FIGS. 81-83 are perspective view of components of the module;

FIG. 84 is a partial cross-sectional view showing over-molding ofcontacts of an interface of the module;

FIGS. 85-86 are plan views of the module showing a light assemblyaccording to aspects of the invention;

FIGS. 87-90 are internal views of the module showing components of thelight assembly; and

FIGS. 91-94 are views of a PCB and a ground plane extender associatedwith the module according to aspects of the invention.

DETAILED DESCRIPTION

While this invention is susceptible of embodiment in many differentforms, there are shown in the drawings, and will herein be described indetail, preferred embodiments of the invention with the understandingthat the present disclosure is to be considered as an exemplification ofthe principles of the invention and is not intended to limit the broadaspects of the invention to the embodiments illustrated and described.

Footwear, such as a shoe, is shown as an example in FIGS. 1-2 andgenerally designated with the reference numeral 100. The footwear 100can take many different forms, including, for example, various types ofathletic footwear. In one exemplary embodiment, the shoe 100 generallyincludes a force and/or pressure sensor system 12 operably connected toa universal communication port 14. As described in greater detail below,the sensor system 12 collects performance data relating to a wearer ofthe shoe 100. Through connection to the universal communication port 14,multiple different users can access the performance data for a varietyof different uses as described in greater detail below.

An article of footwear 100 is depicted in FIGS. 1-2 as including anupper 120 and a sole structure 130. For purposes of reference in thefollowing description, footwear 100 may be divided into three generalregions: a forefoot region 111, a midfoot region 112, and a heel region113, as illustrated in FIG. 1. Regions 111-113 are not intended todemarcate precise areas of footwear 100. Rather, regions 111-113 areintended to represent general areas of footwear 100 that provide a frameof reference during the following discussion. Although regions 111-113apply generally to footwear 100, references to regions 111-113 also mayapply specifically to upper 120, sole structure 130, or individualcomponents included within and/or formed as part of either upper 120 orsole structure 130.

As further shown in FIGS. 1 and 2, the upper 120 is secured to solestructure 130 and defines a void or chamber for receiving a foot. Forpurposes of reference, upper 120 includes a lateral side 121, anopposite medial side 122, and a vamp or instep area 123. Lateral side121 is positioned to extend along a lateral side of the foot (i.e., theoutside) and generally passes through each of regions 111-113.Similarly, medial side 122 is positioned to extend along an oppositemedial side of the foot (i.e., the inside) and generally passes througheach of regions 111-113. Vamp area 123 is positioned between lateralside 121 and medial side 122 to correspond with an upper surface orinstep area of the foot. Vamp area 123, in this illustrated example,includes a throat 124 having a lace 125 or other desired closuremechanism that is utilized in a conventional manner to modify thedimensions of upper 120 relative the foot, thereby adjusting the fit offootwear 100. Upper 120 also includes an ankle opening 126 that providesthe foot with access to the void within upper 120. A variety ofmaterials may be used for constructing upper 120, including materialsthat are conventionally utilized in footwear uppers. Accordingly, upper120 may be formed from one or more portions of leather, syntheticleather, natural or synthetic textiles, polymer sheets, polymer foams,mesh textiles, felts, non-woven polymers, or rubber materials, forexample. The upper 120 may be formed from one or more of these materialswherein the materials or portions thereof are stitched or adhesivelybonded together, e.g., in manners that are conventionally known and usedin the art.

Upper 120 may also include a heel element (not shown) and a toe element(not shown). The heel element, when present, may extend upward and alongthe interior surface of upper 120 in the heel region 113 to enhance thecomfort of footwear 100. The toe element, when present, may be locatedin forefoot region 111 and on an exterior surface of upper 120 toprovide wear-resistance, protect the wearer's toes, and assist withpositioning of the foot. In some embodiments, one or both of the heelelement and the toe element may be absent, or the heel element may bepositioned on an exterior surface of the upper 120, for example.Although the configuration of upper 120 discussed above is suitable forfootwear 100, upper 120 may exhibit the configuration of any desiredconventional or non-conventional upper structure without departing fromthis invention.

As shown in FIG. 3, the sole structure 130 is secured to a lower surfaceof upper 120 and may have a generally conventional shape. The solestructure 130 may have a multipiece structure, e.g., one that includes amidsole 131, an outsole 132, and a foot contacting member 133. The footcontacting member 133 is typically a thin, compressible member that maybe located within the void in upper 120 and adjacent to a lower surfaceof the foot (or between the upper 120 and midsole 131) to enhance thecomfort of footwear 100. In various embodiments, the foot contactingmember 133 may be a sockliner, a strobel, an insole member, a bootieelement, a sock, etc. In the embodiment shown in FIGS. 3-5, the footcontacting member 133 is an insole member or a sockliner. The term “footcontacting member,” as used herein does not necessarily imply directcontact with the user's foot, as another element may interfere withdirect contact. Rather, the foot contacting member forms a portion ofthe inner surface of the foot-receiving chamber of an article offootwear. For example, the user may be wearing a sock that interfereswith direct contact. As another example, the sensor system 12 may beincorporated into an article of footwear that is designed to slip over ashoe or other article of footwear, such as an external bootie element orshoe cover. In such an article, the upper portion of the sole structuremay be considered a foot contacting member, even though it does notdirectly contact the foot of the user. In some arrangements, an insoleor sockliner may be absent, and in other embodiments, the footwear 100may have a foot contacting member positioned on top of an insole orsockliner.

Midsole member 131 may be or include an impact attenuating member, andmay include multiple members or elements in some embodiments. Forexample, the midsole member 131 may be formed of polymer foam material,such as polyurethane, ethylvinylacetate, or other materials (such asphylon, phylite, etc.) that compress to attenuate ground or othercontact surface reaction forces during walking, running, jumping, orother activities. In some example structures according to thisinvention, the polymer foam material may encapsulate or include variouselements, such as a fluid-filled bladder or moderator, that enhance thecomfort, motion-control, stability, and/or ground or other contactsurface reaction force attenuation properties of footwear 100. In stillother example structures, the midsole 131 may include additionalelements that compress to attenuate ground or other contact surfacereaction forces. For instance, the midsole 131 may include column typeelements to aid in cushioning and absorption of forces.

Outsole 132 is secured to a lower surface of midsole 131 in thisillustrated example footwear structure 100 and is formed of awear-resistant material, such as rubber or a flexible syntheticmaterial, such as polyurethane, that contacts the ground or othersurface during ambulatory or other activities. The material formingoutsole 132 may be manufactured of suitable materials and/or textured toimpart enhanced traction and slip resistance. The outsole 132 shown inFIGS. 1 and 2 is shown to include a plurality of incisions or sipes 136in either or both sides of the outsole 132, although many other types ofoutsoles 132 with various types of treads, contours, and otherstructures may be used in connection with the present invention. It isunderstood that embodiments of the present invention may be used inconnection with other types and configurations of shoes, as well asother types of footwear and sole structures.

FIGS. 1-5 illustrate exemplary embodiments of the footwear 100incorporating a sensor system 12 in accordance with the presentinvention, and FIGS. 3-22B illustrate exemplary embodiments of thesensor system 12. The sensor system 12 includes an insert member 37having a force and/or pressure sensor assembly 13 connected thereto. Theinsert member 37 is configured to be positioned in contact with the solestructure 130 of the footwear 100, and in one embodiment, the insertmember 37 is configured to be positioned underneath the foot contactingmember 133 and over the top of the midsole member 131 and in generalconfronting relation. The sensor assembly 13 includes a plurality ofsensors 16, and a communication or output port 14 in communication withthe sensor assembly 13 (e.g., electrically connected via conductors).The port 14 is configured for communicating data received from thesensors 16, such as to an electronic module (also referred to as anelectronic control unit) 22 as described below. The port 14 and/or themodule 22 may be configured to communicate with an external device, asalso described below. In the embodiment illustrated in FIGS. 3-5, thesystem 12 has four sensors 16: a first sensor 16 a at the big toe (firstphalange or hallux) area of the shoe, two sensors 16 b-c at the forefootarea of the shoe, including a second sensor 16 b at the first metatarsalhead region and a third sensor 16 c at the fifth metatarsal head region,and a fourth sensor 16 d at the heel. These areas of the foot typicallyexperience the greatest degree of pressure during movement. Each sensor16 is configured for detecting a pressure exerted by a user's foot onthe sensor 16. The sensors communicate with the port 14 through sensorleads 18, which may be wire leads and/or another electrical conductor orsuitable communication medium. For example, in the embodiment of FIGS.3-5, the sensor leads 18 may be an electrically conductive medium thatis printed on the insert member 37, such as a silver-based ink or othermetallic ink, such as an ink based on copper and/or tin. The leads 18may alternately be provided as thin wires in one embodiment. In otherembodiments, the leads 18 may be connected to the foot contacting member133, the midsole member 131, or another member of the sole structure130.

Other embodiments of the sensor system 12 may contain a different numberor configuration of sensors 16, and generally include at least onesensor 16. For example, in one embodiment, the system 12 includes a muchlarger number of sensors, and in another embodiment, the system 12includes two sensors, one in the heel and one in the forefoot of theshoe 100. In addition, the sensors 16 may communicate with the port 14in a different manner, including any known type of wired or wirelesscommunication, including Bluetooth and near-field communication. A pairof shoes may be provided with sensor systems 12 in each shoe of thepair, and it is understood that the paired sensor systems may operatesynergistically or may operate independently of each other, and that thesensor systems in each shoe may or may not communicate with each other.The communication of the sensor systems 12 is described in greaterdetail below. It is understood that the sensor system 12 may be providedwith computer programs/algorithms to control collection and storage ofdata (e.g., pressure data from interaction of a user's foot with theground or other contact surface), and that these programs/algorithms maybe stored in and/or executed by the sensors 16, the module 22, and/orthe external device 110.

The sensor system 12 can be positioned in several configurations in thesole 130 of the shoe 100. In the examples shown in FIGS. 3-5, the port14, the sensors 16, and the leads 18 can be positioned between themidsole 131 and the foot contacting member 133, such as by positioningthe insert member 37 between the midsole 131 and the foot contactingmember 133. The insert member 37 may be connected to one or both of themidsole and the foot contacting member 133 in one embodiment. A cavityor well 135 can be located in the midsole 131 (FIG. 5) and/or in thefoot contacting member 133 for receiving the electronic module 22, asdescribed below, and the port 14 may be accessible from within the well135 in one embodiment. The well 135 may further contain a housing 24 forthe module 22, and the housing 24 may be configured for connection tothe port 14, such as by providing physical space for the port 14 and/orby providing hardware for interconnection between the port 14 and themodule 22. In the embodiment shown in FIG. 5, the well 135 is formed bya cavity in the upper major surface of the midsole 131. As shown in FIG.5, the sole structure 130 may include a compressible sole member 138that has a hole formed therein to receive the housing 24, which providesaccess to the well 135 and/or may be considered a portion of the well135. The insert 37 can be placed on top of the compressible sole member138 to place the housing 24 in the well 135. The compressible solemember 138 may confront the midsole 131 in one embodiment, and may be indirect contact with the midsole 131. It is understood that thecompressible sole member 138 may confront the midsole 131 with one ormore additional structures positioned between the compressible solemember 138 and the midsole 131, such as a strobel member. In theembodiment of FIGS. 3-5, the compressible sole member 138 is in the formof a foam member 138 (e.g. an EVA member) located between the footcontacting member 133 and the midsole 131, which may be considered alower insole/sockliner in this embodiment. The foam member 138 may bebonded to a strobel 133A (FIG. 58) of the midsole 131 in one embodiment,such as by use of an adhesive, and may cover any stitching on thestrobel, which can prevent abrasion of the insert 37 by the stitching.This configuration is shown schematically in FIG. 58. In the embodimentshown in FIGS. 3-5, the housing 24 has a plurality of walls, includingside walls 25 and a base wall 26, and also includes a flange or lip 28that extends outward from the tops of the side walls 25 and isconfigured for connection to the insert 37. In one embodiment, theflange 28 is a separate member that connects to a tub 29 to form thehousing 24, via pegs 28A that connect through holes 28B in the insert 37located at the front end of the hole 27. The pegs 28A may be connectedvia ultrasonic welding or other technique, and may be received inreceivers in one embodiment. In an alternate embodiment, an article offootwear 100 may be manufactured with the tub 29 formed in the solestructure 130, and the flange 28 may be later connected, such as by asnap connection, optionally after other portions of the port have alsobeen assembled. The housing 24 may include retaining structure to retainthe module 22 within the housing 24, and such retaining structure may becomplementary with retaining structure on the module 22, such as atab/flange and slot arrangement, complementary tabs, locking members,friction-fit members, etc. The housing 24 also includes a finger recess29A located in the flange 28 and/or the tub 29, which provides room forthe user's finger to engage the module 22 to remove the module 22 fromthe housing 24. The flange 28 provides a wide base engaging the top ofthe insert 37, which spreads out the forces exerted on the insert 37and/or on the foot contacting member 133 by the flange 28, which createsless likelihood of severe deflection and/or damage of such components.The rounded corners on the flange 28 also assists in avoiding damage tothe insert 37 and/or the foot contacting member 133. It is understoodthat the flange 28 may have a different shape and/or contour in otherembodiments, and may provide similar functionality with different shapesand/or contours.

The foot contacting member 133 is configured to be placed on top of thefoam member 138 to cover the insert 37, and may contain an indent 134 inits lower major surface to provide space for the housing 24, as shown inFIG. 3. The foot contacting member 133 may be adhered to the foam member138, and in one embodiment, may be adhered only in the forefoot regionto permit the foot contacting member 133 to be pulled up to access themodule 22, as shown in FIG. 3. Additionally, the foot contacting member133 may include a tacky or high-friction material (not shown) located onat least a portion of the underside to resist slippage against theinsert 37 and/or the foam member 138, such as a silicone material. Forexample, in an embodiment where the foot contacting member 133 isadhered in the forefoot region and free in the heel region (e.g. FIG.3), the foot contacting member 133 may have the tacky material locatedon the heel region. The tacky material may also provide enhanced sealingto resist penetration of dirt into the sensor system. In anotherembodiment, as shown in FIG. 60, the foot contacting member 133 mayinclude a door or hatch 137 configured to be located over the port 14and sized to permit insertion and/or removal of the module 22 throughthe foot contacting member 133. The embodiment of the foot contactingmember 133 shown in FIG. 60 may be usable in place of the footcontacting member 133 in FIG. 3, 36, or 45, to provide access to theport 14 and the module 22. In the embodiment shown in FIG. 60, the door137 has a hinge 137A formed by material attachment along one edge of thedoor 137, allowing the door 137 to be opened and closed by swinging.Additionally, the door 137 is formed of the same material as the footcontacting member 133 in this embodiment, so that no significant loss ofcushioning is lost by inclusion of the door 137. Further, the door 137may have a tab 137B or other structure to aid in gripping andmanipulation of the door 137 by the user. In one embodiment, the sensorsystem 12 may be positioned on the underside of the foot contactingmember 133, and the door 137 may provide access to the port 14 in suchan embodiment (not shown). In another embodiment, the door 137 may havea hinge on another edge, or may open in a different manner, such as byremoval, sliding, etc. In one embodiment, the foot contacting member 133may also have graphic indicia 92 thereon, as described below.

In one embodiment, as shown in FIGS. 3-5 and 7, the foam member 138 mayalso include a recess 139 having the same peripheral shape as the insert37 to receive the insert 37 therein, and the bottom layer 69 (FIG. 13)of the insert member 37 may include adhesive backing to retain theinsert 37 within the recess 139. In one embodiment, a relatively strongadhesive, such as a quick bonding acrylic adhesive, may be utilized forthis purpose. The insert 37 has a hole or space 27 for receiving andproviding room for the housing 24, and the foam member 138 in thisembodiment may also allow the housing 24 to pass completely through intoand/or through at least a portion of the strobel and/or the midsole 131.In the embodiment shown in FIGS. 3-5, the foot contacting member 133 mayhave a thickness that is reduced relative to a typical foot contactingmember 133 (e.g. sockliner), with the thickness of the foam member 138being substantially equal to the reduction in thickness of the footcontacting member 133, to provide equivalent cushioning. In oneembodiment, the foot contacting member 133 may be a sockliner with athickness of about 2-3 mm, and the foam member 138 may have a thicknessof about 2 mm, with the recess 139 having a depth of about 1 mm. Thefoam member 138 may be adhesively connected to the insert member 37prior to connecting the foam member 138 to the article of footwear 100in one embodiment. This configuration permits the adhesive between thefoam member 138 and the insert 37 to set in a flat condition beforeattaching the foam member to the strobel or other portion of thefootwear 100, which is typically bends or curves the foam member 138 andmay otherwise cause delamination. The foam member 138 with the insert 37adhesively attached may be provided in this configuration as a singleproduct for insertion into an article of footwear 100 in one embodiment.The positioning of the port 14 in FIGS. 3-5 not only presents minimalcontact, irritation, or other interference with the user's foot, butalso provides easy accessibility by simply lifting the foot contactingmember 133.

In the embodiment of FIGS. 3-5, the housing 24 extends completelythrough the insert 37 and the foam member 138, and the well 135 alsoextends completely through the strobel 133A and partially into themidsole 131 of the footwear 100 to receive the housing 24, asillustrated schematically in FIG. 58. In another embodiment, the well135 may be differently configured, and may be positioned completelyunderneath the strobel 133A in one embodiment, with a window through thestrobel 133A to permit access to the module 22 in the well 135. The well135 may be formed using a variety of techniques, including cutting orremoving material from the strobel 133A and/or the midsole 131, formingthe strobel 133A and/or the midsole 131 with the well contained therein,or other techniques or combinations of such techniques. In oneembodiment, a hot knife 109 is used to cut through the strobel 133A andinto the midsole 131 to remove a piece 135A of material to form the well135, as illustrated schematically in FIG. 57. In this embodiment, thehot knife 109 includes a wall 109A extending around the periphery of thehot knife 109 to define a cavity 109B that receives the piece 135A to beremoved, as well as prongs 109C that extend down through the middle ofthe piece 135A. The wall 109A cuts down into the strobel 133A and themidsole 131 to cut the outer boundaries of the piece 135A to be removed.The prongs 109C both weaken the bottom side of the piece 135A tofacilitate removal and also assist in retaining the piece 135A withinthe cavity 109B during removal, so the piece 135A can be removed bysimply lifting the hot knife 109 away from the sole structure 130. Inone embodiment, the hot knife 109 may be heated to a temperature ofbetween 250-260° C. In other embodiments, a hot knife 109 (which may bedifferently configured) may be utilized to form a differently shapedand/or configured well 135 in the sole structure 130. FIG. 58schematically illustrates the insert 37 connected to the sole structure130 and the housing 24 received in the well 135 after formation. Asshown in FIG. 58, the housing 24 fits closely with the walls of the well135, which can be advantageous, as gaps between the housing 24 and thewell 135 may be sources of material failure. The process of removing thepiece 135 may be automated using appropriate computer control equipment.

The well 135 may be located elsewhere in the sole structure 130 infurther embodiments. For example, the well 135 may be located in theupper major surface of the foot contacting member 133 and the insert 37can be placed on top of the foot contacting member 133. As anotherexample, the well 135 may be located in the lower major surface of thefoot contacting member 133, with the insert 37 located between the footcontacting member 133 and the midsole 131. As a further example, thewell 135 may be located in the outsole 132 and may be accessible fromoutside the shoe 100, such as through an opening in the side, bottom, orheel of the sole 130. In the configurations illustrated in FIGS. 3-5,the port 14 is easily accessible for connection or disconnection of anelectronic module 22, as described below. In the embodiment illustratedin FIG. 59, the foot contacting member 133 has the insert 37 connectedto the bottom surface, and the port 14 and the well 135 are formed inthe sole structure 130, such as in the same configuration describedabove and shown in FIG. 58. The interface 20 is positioned on the sideof the housing 24 as similarly shown with respect to other embodiments,although it is understood that the interface 20 could be positionedelsewhere, such as for engagement through the top of the module 22. Themodule 22 may be altered to accommodate such a change. In thisembodiment, the foot contacting member 133 may be provided with anopening for accessing the module 22 (such as in FIG. 60) or may be ableto be pulled upward to access the module 22, as shown in FIG. 3. In theembodiment illustrated in FIG. 59A, the insert 37 is positioned belowboth the foot contacting member 133 and the strobel 133A, and in contactwith the midsole member 131. In this embodiment, the strobel 133A and/orthe foot contacting member 133 may be provided with openings foraccessing the module 22 and/or may be able to be pulled upward to accessthe module 22, as shown in FIG. 3.

In other embodiments, the sensor system 12 can be positioneddifferently. For example, in one embodiment, the insert 37 can bepositioned within the outsole 132, midsole 131, or foot contactingmember 133. In one exemplary embodiment, insert 37 may be positionedwithin a foot contacting member 133 positioned above an insole member,such as a sock, sockliner, interior footwear bootie, or other similararticle, or may be positioned between the foot contacting member 133 andthe insole member. Still other configurations are possible, and someexamples of other configurations are described below. As discussed, itis understood that the sensor system 12 may be included in each shoe ina pair.

The insert member 37 in the embodiment illustrated in FIGS. 3-22B isformed of multiple layers, including at least a first layer 66 and asecond layer 68. The first and second layers 66, 68 may be formed of aflexible film material, such as a Mylar® or other PET (polyethyleneterephthalate) film, or another polymer film, such as polyamide. In oneembodiment, the first and second layers 66, 68 may each be PET filmshaving thicknesses of 0.05-0.2 mm, such as a thickness of 125 μm.Additionally, in one embodiment, each of the first and second layers 66,68 has a minimum bend radius of equal to or less than 2 mm. The insert37 may further include a spacer layer 67 positioned between the firstand second layers 66, 68 and/or a bottom layer 69 positioned on thebottom of the insert 37 below the second layer 68, which are included inthe embodiment illustrated in FIGS. 3-22B. The layers 66, 67, 68, 69 ofthe insert 37 are stacked on top of each other and in confrontingrelation to each other, and in one embodiment, the layers 66, 67, 68, 69all have similar or identical peripheral shapes and are superimposed onone another (FIG. 13). In one embodiment, the spacer layer 67 and thebottom layer 69 may each have a thickness of 89-111 μm, such as athickness of 100 μm. The entire thickness of the insert member 37 may beabout 450 μm in one embodiment, or about 428-472 μm in anotherembodiment, and about 278-622 μm in a further embodiment. The insert 37may also include additional adhesive that is 100-225 μm thick, and mayfurther include one or more selective reinforcement layers, such asadditional PET layers, in other embodiments. Additionally, in oneembodiment, the entire four-layer insert as described above has aminimum bend radius of equal to or less than 5 mm. It is understood thatthe orientations of the first and second layers 66, 68 may be reversedin another embodiment, such as by placing the second layer 68 as the toplayer and the first layer 66 below the second layer 68. In theembodiment of FIGS. 3-22B, the first and second layers 66, 68 havevarious circuitry and other components printed thereon, including thesensors 16, the leads 18, resistors 53, 54, a pathway 50, dielectricpatches 80, and other components, which are described in greater detailbelow. The components are printed on the underside of the first layer 66and on the upper side of the second layer 68 in the embodiment of FIGS.3-22B, however in other embodiments, at least some components may beprinted on the opposite sides of the first and second layers 66, 68. Itis understood that components located on the first layer 66 and/or thesecond layer 68 may be moved/transposed to the other layer 66, 68. Inone embodiment, the components may be printed on the layers 66, 68 in amanner so as to limit the total number of printer passes required, andin one embodiment, all the components on an individual layer 66, 68 maybe printed in a single pass.

The layers 66, 67, 68, 69 can be connected together by an adhesive orother bonding material in one embodiment. The spacer layer 67 maycontain adhesive on one or both surfaces in one embodiment to connect tothe first and second layers 66, 68. The bottom layer 69 may likewisehave adhesive on one or both surfaces, to connect to the second layer 68as well as to the article of footwear 100. The first or second layers66, 68 may additionally or alternately have adhesive surfaces for thispurpose. A variety of other techniques can be used for connecting thelayers 66, 67, 68, 69 in other embodiments, such as heat sealing, spotwelding, or other known techniques.

The insert 37, the foot contacting member 133, and/or other componentsof the sensor system 12 and the footwear 100 may also include a graphicdesign or other indicia (not shown) thereon. The graphic design may beprovided on one or more graphic layers (not shown) that may be connectedto the insert 37, such as by overlaying the graphic layer on top of thefirst layer 66. The graphic design may correspond to the sensor assembly13, leads 18 and the various other components supported by the layer.For example, in the embodiment of FIG. 60, the foot contacting member133 has graphical indicia 92 that forms a graphical depiction of theinsert 37 of the sensor system 12 that is positioned below the footcontacting member 133. Other graphical designs may be used in otherembodiments, including informative, stylistic, and other such designs.

The insert 37 illustrated in FIGS. 3-22B has a configuration that mayutilize less material than other insert configurations and may providegreater resistance to tearing at common stress points. In thisembodiment, the insert 37 has several portions of material cut out ofareas of the insert 37 that may be superfluous, such as in the lateralforefoot area or the lateral and medial heel areas. The insert 37 inthis configuration has a midfoot portion 37A configured to be engaged bythe midfoot region of the user's foot and a forefoot portion 37Bconfigured to be engaged by the forefoot (i.e. metatarsal) region of theuser's foot, with a heel portion 37C extending rearwardly from themidfoot portion 37A and a first phalange portion 37D extending forwardlyfrom the forefoot portion, configured to be engaged by the heel regionand the first phalange region of the user's foot, respectively. FIGS. 4,8, 10, and 22A illustrate these features in greater detail. It isunderstood that, depending on the shape of the user's foot, the firstphalange portion 37D may engage only the first phalange region of theuser's foot. In this embodiment, the width of the forefoot portion 37Bis greater than the width of the midfoot portion 37A, and both themidfoot and forefoot portions 37A-B have greater width than the firstphalange portion 37D and the heel portion 37C, such that the firstphalange portion 37D and the heel portion 37C are configured aspeninsulas that extend forward or rearward, respectively, from a base atthe wider midfoot and forefoot portions 37A-B to a free end in elongatedmanners. As referred to herein, the width of a portion of the insert 37is measured in the medial-to-lateral direction, and the length ismeasured in the front-to-rear (toe-to-heel) direction. In the embodimentof FIGS. 3-22B, the first phalange portion 37D has one of the sensors 16a located thereon, to be engaged by the first phalange of the user, andthe heel portion 37C has another one of the sensors 16 d thereon, to beengaged by the heel of the user. The remaining two sensors 16 b, 16 care located on the forefoot portion 37B of the insert 37, specificallyat the first metatarsal head region and at the fifth metatarsal headregion, to be engaged by the first and fifth metatarsal head regions ofthe user's foot, respectively. The midfoot portion 37A contains the hole27 for receiving the housing 24 and module 22, and the hole 27 definestwo strips 88 that extend between and connect the forefoot portion 37Band the heel portion 37C. In one embodiment, the strips 88 have minimumwidths of 8 mm or widths within a range of 3-5% of the overall length ofthe insert 37. In this usage, the length of the insert 37 is measuredfrom the forefoot-most end of the first phalange portion 37D to theheel-most end of the heel portion 37C. These strips 88 undergo highstresses during use, and this width assists in avoiding failure duringuse. In other embodiments, the strips 88 may be reinforced by additionalstructure. For example, in one embodiment, the strips 88 and/or otherportions of the insert 37 may be reinforced by fibers or similarstructures. As another example, the insert 37 may include an additionalstructural layer over at least a portion of the insert 37 in oneembodiment, such as an additional structural layer that completelysurrounds the housing 24 and occupies the entireties of both strips 88and the junctures between the strips 88 and the remainder of the insert37.

In the embodiment shown in FIGS. 3-22B, the insert 37 has a peripheraledge defining a periphery of the insert 37, and including a medial edge85 extending along the medial side of the insert 37 from the back of theheel portion 37C to the front end of the first phalange portion 37D, alateral edge 86 extending from the back of the heel portion 37C to thefront of the forefoot portion 37B, and a front edge 87 extending fromthe lateral edge 86 to the first phalange portion 37D along second,third, fourth, and fifth metatarsal areas of the insert 37. The medialedge 85, the lateral edge 86, and the front edge 87 each have a cut-outportion in this embodiment, as shown, for example, in FIGS. 8, 10, and22A. The cut-out portion 87A along the front edge 87 is located betweenthe lateral edge 86 and the first phalange portion (i.e. peninsula) 37D.The cut-out portions 85A, 86A along the medial and lateral edges 85, 86are located proximate the juncture between the forefoot portion 37B andthe midfoot portion 37A, and the width W1 of the insert 37 (definedbetween the medial and lateral edges 85, 86) in the midfoot portion 37Aand the width W2 in the forefoot portion 37B are greater than the widthW3 of the insert measured between the first and second cut-outs 85A,86A. This configuration creates a narrowed neck 89 between the midfootportion 37A and the forefoot portion 37B that is narrower than eitherthe midfoot portion 37A or the forefoot portion 37B. The widths Wl, W2of the midfoot portion 37A and forefoot portion 37B are also greaterthan the width W4 measured at the heel portion 37C, and the forefootportion 37B has the greatest relative width W2. The heel portion 37C inthis embodiment includes a widened tail portion 37E that is wider thanthe more forward portions of the heel portion 37C, such that the heelportion 37C increases in width from the midfoot portion 37A toward theheel end of the insert member 37.

The cut out portions 85A, 86A, 87A each extend inwardly into the body ofthe insert 37 and generally have a concave and/or indented shape. In theembodiment illustrated in FIGS. 3-22B, each of the cut out portions 85A,86A, 87A has a smooth and concave inwardly curved (curvilinear) shape,which resists ripping, tearing, or propagation of cracks in the insert37. In this embodiment, each of the cut out portions 85A, 86A, 87A is atleast partially defined by a concave curvilinear edge defining an arc ofat least 120°. Additionally, in one embodiment, at least one of the cutout portions 85A, 86A, 87A is at least partially defined by a concavecurvilinear edge defining an arc of at least 180°. As seen, for example,in FIGS. 8, 10, and 22A, at least the medial and lateral cut outportions 85A, 86A are each at least partially defined by a concavecurvilinear edge defining an arc of at least 180°. Additionally, each ofthe cut out portions 85A, 86A, 87A in this embodiment is bounded on bothsides by smoothly curved edges located on the outer periphery of theinsert, at the medial, lateral, and front edges 85, 86, 87. One or bothof the smoothly curved edges bounding each of the cut out portions 85A,86A, 87A in this embodiment defines an arc of at least 90°. The use ofthe cut out portions 85A, 86A, 87A in these locations and with theseconfigurations can increase the durability and longevity of the insert37, for example, by resisting ripping, tearing, or propagation of cracksin the insert 37 as described above. In this embodiment, the cut outportions 85A, 86A, 87A are positioned in high stress areas, where thisdamage resistance is most beneficial. The insert 37 configured as shownin FIGS. 3-22B may have sufficient fatigue resistance to withstandstresses of up to 20 MPa over at least 500,000 cycles.

In further embodiments, the insert 37 may have different cut outportions and/or may have cut out portions in the same locations but withdifferent shapes. For example, the insert 37′ shown in FIGS. 22C-D hascut out portions 85A, 86A, 87A in similar locations as compared to theinsert 37 of FIGS. 3-22B, with the cut out portions 85A, 86A, 87A havingslightly different peripheral shapes. In this embodiment, the medial cutout portion 85A defines a smaller arc as compared to the medial cut outportion 85A of the insert 37 of FIGS. 3-22B. The front cut out portion87A of this embodiment defines a shape that is less symmetrical andevenly curved as compared to the front cut out portion 87A of the insert37 of FIGS. 3-22B.

FIGS. 36-47 illustrate additional embodiments of sensor systems 412, 512with inserts 437, 537 that have different shapes and configurations thanthe sensor system 12 and the insert 37 described above and shown inFIGS. 3-22B. The sensor systems 412, 512 of FIGS. 36-47 include manystructural and functional features in common with the sensor system 12of FIGS. 3-22B. For example, the sensor systems 412, 512 include sensors16 that are configured and positioned substantially the same andfunction in a similar manner as the sensor system 12 of FIGS. 3-22B. Asanother example, the sensor systems 412, 512 include two fixed resistors53, 54 in parallel and a pathway 50 between the layers 66, 68, similarto the sensor system 12 of FIGS. 3-22B. These and other such commonfeatures may not be described again herein for the sake of brevity.

In the embodiment of FIGS. 36-44, the insert 437 has cut out portions85A, 86A, 87A in similar locations as compared to the insert 37 of FIGS.3-22B, with the cut out portions 85A, 86A, 87A having slightly differentperipheral shapes. In this embodiment, the medial cut out portion 85Adefines a smaller arc as compared to the medial cut out portion 85A ofthe insert 37 of FIGS. 3-22B. The front cut out portion 87A of thisembodiment is deeper and defines a larger arc as compared to the frontcut out portion 87A of the insert 37 of FIGS. 3-22B. The lateral cut outportion 86A of this embodiment is shallower and defines a smaller arc ascompared to the lateral cut out portion 86A of the insert 37 of FIGS.3-22B. Additionally, the insert 437 of FIGS. 36-44 has a heel portion37C with a substantially constant width, and has no widened tail portion37E.

In the embodiment of FIGS. 45-47, the insert 537 has cut out portions85A, 86A, 87A in similar locations as compared to the insert 37 of FIGS.3-22B, with the cut out portions 85A, 86A, 87A having slightly differentperipheral shapes. In this embodiment, the medial cut out portion 85Adefines a smaller arc as compared to the medial cut out portion 85A ofthe insert 37 of FIGS. 3-22B. The lateral cut out portion 86A of thisembodiment is shallower and defines a smaller arc as compared to thelateral cut out portion 86A of the insert 37 of FIGS. 3-22B. The frontedge 87 of the insert 537 of FIGS. 45-48 is angled steadily from thefirst phalange portion 37D toward the fifth metatarsal sensor 16 c, anddefines a substantially straight edge that extends directly into thefront cut out portion 87A. The resultant front cut out portion 87Adefines a smaller arc as compared to the front cut out portion 87A ofthe insert 37 of FIGS. 3-22B. Additionally, the insert 537 of FIGS.45-48 has a heel portion 37C with a substantially constant width, andhas no widened tail portion 37E. The leads 18 and many other componentsof the sensor system 512 of FIGS. 45-48 are not illustrated and/orreferenced herein, and it is understood that such components may beconfigured similarly or identically to the corresponding components inthe sensor system 12 of FIGS. 3-22B and/or the sensor system 412 inFIGS. 36-44 (structurally and/or functionally).

It is understood that inserts 37, 37′, 437, 537 may have any number ofdifferent configurations, shapes, and structures, and including adifferent number and/or configuration of sensors 16, and a differentinsert structure or peripheral shape. For example, any of the inserts37, 37′, 437, 537 described herein may include some or all of thestructural features and the functions associated with such structuralfeatures as described above, such as the cut-out portions 85A, 86A, 87Aand other features of the peripheral shape, while being contoured,dimensioned, and configured differently. Additionally, any of theinserts 37, 37′, 437, 537 described herein may include additional ordifferent structural features that may provide different shapes and/orfunctionalities.

In the embodiment illustrated in FIGS. 3-22B, the sensors 16 are forceand/or pressure sensors for measuring pressure and/or force on the sole130. The sensors 16 have a resistance that decreases as pressure on thesensor 16 increases, such that measurement of the resistance through theport 14 can be performed to detect the pressure on the sensor 16. Thesensors 16 in the embodiment illustrated in FIGS. 3-22B are ellipticalor obround in shape, which enables a single sensor size to be utilizedin several different shoe sizes. The sensors 16 in this embodiment eachinclude two contacts 40, 42, including a first contact 40 positioned onthe first layer 66 and a second contact 42 positioned on the secondlayer 68. It is understood that the figures illustrating the first layer66 herein are top views, and that the electronic structures (includingthe contacts 40, the leads 18, etc.) are positioned on the bottom sideof the first layer 66 and viewed through a transparent or translucentfirst layer 66 unless specifically noted otherwise. The contacts 40, 42are positioned opposite each other and are in superimposed relation toeach other, so that pressure on the insert member 37, such as by theuser's foot, causes increased engagement between the contacts 40, 42.The resistance of the sensor 16 decreases as the engagement between thecontacts 40, 42 increases, and the module 22 is configured to detectpressure based on changes in resistance of the sensors 16. In oneembodiment, the contacts 40, 42 may be formed by conductive patches thatare printed on the first and second layers 66, 68, such as in theembodiment of FIGS. 3-22B, and the two contacts 40, 42 may be formed ofthe same or different materials. Additionally, in one embodiment, theleads 18 are formed of a material that has a higher conductivity andlower resistivity than the material(s) of the sensor contacts 40, 42.For example, the patches may be formed of carbon black or anotherconductive carbon material. Further, in one embodiment, the two contacts40, 42 may be formed of the same material or two materials with similarhardnesses, which can reduce abrasion and wear due to differences inhardness of the materials in contact with each other. In thisembodiment, the first contacts 40 are printed on the underside of thefirst layer 66, and the second contacts 42 are printed on the top sideof the second layer 68, to permit engagement between the contacts 40,42. The embodiment illustrated in FIGS. 3-22B includes the spacer layer67, which has holes 43 positioned at each sensor 16 to permit engagementof the contacts 40, 42 through the spacer layer 67, while insulatingother portions of the first and second layers 66, 68 from each other. Inone embodiment, each hole 43 is aligned with one of the sensors 16 andpermits at least partial engagement between the contacts 40, 42 of therespective sensor 16. In the embodiment illustrated in FIGS. 7-18, theholes 43 are smaller in area than the sensor contacts 40, 42, allowingthe central portions of the contacts 40, 42 to engage each other, whileinsulating outer portions of the contacts 40, 42 and the distributionleads 18A from each other (See, e.g., FIGS. 13 and 35A-B). In anotherembodiment, the holes 43 may be sized to permit engagement between thecontacts 40, 42 over their entire surfaces. It is understood that thesize, dimensions, contours, and structure of the sensors 16 and thecontacts 40, 42 may be altered in other embodiments while retainingsimilar functionality. It is also understood that sensors 16 having thesame sizes may be utilized in different sizes of inserts 37 fordifferent shoe sizes, in which case the dimensions of the sensors 16relative to the overall dimensions of the insert 37 may be different fordifferent insert 37 sizes.

In other embodiment, the sensor system 12 may have sensors 16 that aredifferently configured than the sensors 16 of the embodiment of FIGS.3-22B. For example, FIGS. 33-34 illustrate additional embodiments ofsensor systems 212, 312 that have sensors 16 that are configureddifferently from the sensors 16 in the sensor system 12 of FIGS. 3-22B.In the embodiments illustrated in FIGS. 33-34, the contacts 40, 42 ofthe sensors 16 in FIGS. 33-34 are configured differently from thecontacts 40, 42 of the sensors 16 in the embodiment of FIGS. 3-22B.Other components and features of the sensor systems 212, 312 are similaror identical to those of the sensor system 12 of FIGS. 3-22B, includingany variations or alternate embodiments described herein. As anotherexample, FIGS. 48-51 illustrate an embodiment of a sensor system 712that includes sensors 16 that have contacts 740, 742, 744 that areconfigured differently from the sensors 16 and contacts 40, 42 of theembodiment of FIGS. 3-22B. In a further example, the sensors 16 mayutilize a different configuration that does not include carbon-based orsimilar contacts 40, 42 and/or may not function as a resistive sensor16. Examples of such sensors include a capacitive pressure sensor or astrain gauge pressure sensor, among other examples.

As further shown in FIGS. 3-22B, in one embodiment, the insert 37 mayinclude an internal airflow system 70 configured to allow airflowthrough the insert 37 during compression and/or flexing of the insert37. FIGS. 9, 11, 13, 18, 22A-B, and 28-30 illustrate the components ofthe airflow system 70 in greater detail. The airflow system 70 mayinclude one or more air passages or channels 71 that lead from thesensors 16 to one or more vents 72, to allow air to flow from the sensor16 during compression, between the first and second layers 66, 68 andoutward through the vent(s) 72 to the exterior of the insert 37. Theairflow system 70 resists excessive pressure buildup during compressionof the sensors 16, and also permits consistent separation of thecontacts 40, 42 of the sensors 16 at various air pressures andaltitudes, leading to more consistent performance. The channels 71 maybe formed between the first and second layers 66, 68. As shown in FIG.18, the spacer layer 67 has the channels 71 formed therein, and the aircan flow through these channels 71 between the first and second layers66, 68, to the appropriate vent(s) 72. The vents 72 may have filters 73covering them in one embodiment, as shown in FIG. 22B. These filters 73may be configured to permit air, moisture, and debris to pass out of thevents 72 and resist moisture and debris passage into the vents 72. Inanother embodiment, the insert 37 may not contain a spacer layer, andthe channels 71 may be formed by not sealing the layers 66, 68 togetherin a specific pattern, such as by application of a non-sealablematerial. Thus, the airflow system 70 may be considered to be integralwith or directly defined by the layers 66, 68 in such an embodiment. Inother embodiments, the airflow system 70 may contain a different numberor configuration of air channels 71, vents 72, and/or other passages.

In the embodiment illustrated in FIGS. 3-22B, 28, and 30, the airflowsystem 70 includes two vents 72 and a plurality of air channels 71connecting each of the four sensors 16 to one of the vents 72. Thespacer layer 67 includes holes 43 at each sensor in this embodiment, andthe channels 71 are connected to the holes 43 to permit air to flow awayfrom the sensor 16 through the channel 71. Additionally, in thisembodiment, two of the sensors 16 are connected to each of the vents 72through channels 71. For example, as illustrated in FIGS. 4 and 7-18,the first metatarsal sensor 16 b has a channel 71 that extends to a vent72 slightly behind the first metatarsal area of the insert 37, and thefirst phalangeal sensor 16 a has a channel 71 that also extends to thesame vent 72, via a passageway that includes traveling through the firstmetatarsal sensor 16 b. In other words, the first phalangeal sensor 16 ahas a channel 71 that extends from the hole 43 at the first phalangealsensor 16 a to the hole 43 at the first metatarsal sensor 16 b, andanother channel 71 extends from the first metatarsal sensor 16 b to thevent 72. The fifth metatarsal sensor 16 c and the heel sensor 16 d alsoshare a common vent 72, located in the heel portion of the insert 37.One channel 71 extends rearward from the hole 43 at the fifth metatarsalsensor 16 c to the vent 72, and another channel 71 extends forward fromthe hole 43 at the heel sensor 16 d to the vent 72. Sharing the vents 72among multiple sensors can decrease expense, particularly by avoidingthe need for additional filters 73. In other embodiments, the airflowsystem 70 may have a different configuration, such as the configurationshown in FIGS. 22C-D and discussed below. In further embodiments, eachsensor 16 may have its own individual vent 72, or more than two sensors16 may share the same vent 72.

Each vent 72 is formed as an opening in a bottom side of the secondlayer 68 (i.e. opposite the first layer 66), such that the openingpermits outward flow of air, moisture, and/or debris from the airflowsystem 70, as seen in FIGS. 16-18 and 22A-B. In another embodiment, thevent 72 may include multiple openings. In a further embodiment, the vent72 may additionally or alternately be formed by an opening in the firstlayer 66, causing the air to vent upwards out of the insert 37. In anadditional embodiment, the vent 72 may be on the side (thin edge) of theinsert 37, such as by extending the channel 71 to the edge, such thatthe channel 71 opens through the edge to the exterior of the insert 37.The venting of the air downward, as in the embodiment illustrated inFIGS. 3-22B, 28, and 30, makes it more difficult for debris to enter thevent 72. The bottom layer 69, if present, also includes apertures 74located below the vents 72, to permit the air flowing out of the vents72 to pass through the bottom layer 69. The apertures 74 aresignificantly larger than the vents 72, in order to allow the filters 73to be adhesively attached to the second layer 68 through the bottomlayer 69 around the periphery of each vent 72, as described below.Additionally, in this embodiment, each vent 72 has a reinforcementmaterial 75 positioned around the vent 72, to add stability and strengthto the material and prevent breaking/tearing. In the embodimentillustrated, the reinforcement material 75 is formed of the samematerial as the leads 18 (e.g. silver or other metallic ink) tofacilitate printing, but may also be formed of the same material as thesensor contacts 40, 42 (e.g. carbon) or the dielectric materialdiscussed herein.

The vents 72 in the embodiment illustrated in FIGS. 3-22B, 28, and 30open downward and the air passing through the vents 72 passes downwardtoward the midsole 131 and toward the foam member 138 if present. In theembodiment illustrated in FIGS. 3-5, 28, and 30, the foam member 138 hascavities 76 located directly below the vents 72 and configured such thatthe air exiting the vents passes into the respective cavity 76. In theembodiment illustrated in FIGS. 3-5, 28, and 30, each cavity 76 isformed as a slot that extends completely through the foam member 138,which may be formed by punching, cutting, or another technique. Inanother embodiment, the cavity 76 may be a recess that extends throughonly a portion of the foam member 138, or may extend deeper than thefoam member 138, such as through at least a portion of a structure belowthe foam member 138 (e.g. a strobel, midsole, etc.). In a furtherembodiment, the sole structure may not contain the foam member 138, andthe cavity 76 may be formed at least in part by a slot, recess, or othercavity-like structure in another sole member, such as a strobel,midsole, etc. As shown in FIG. 5, at least a portion of the cavity 76may be circular in one embodiment, and may extend wider than the vent 72to provide space for air venting. This configuration allows air to passout of the vents 72 without obstruction from the foam member 138. Inanother embodiment, the insert 37 may be positioned above another solemember (such as a portion of the midsole 131), which may contain one ormore cavities 76 as described above. In a further embodiment, no cavitymay be present, and the air may vent 72 directly downward into the foammember 138 or other sole member. One or both of the cavities 76 may haveextending portions that form passages 77 that further allow air to passout of the cavity 76. In the embodiment of FIGS. 3-5, 28, and 30, eachof the cavities 76 has a channel portion 77 extending laterally awayfrom the cavity 76 and beyond the peripheral boundary of the insert 37.In other words, the channel portion 77 of the cavity 76 extendslaterally from the vent 72 to a distal end 78 located outside theperipheral boundary of the insert 37. It is understood that if the foammember 138 has a recess 139 to receive the insert member 37, the distalend 78 of the channel portion 77 of the cavity 76 may also be locatedoutside the peripheral boundary of the recess 139. In the embodimentshown in FIGS. 3-5, the distal end 78 extends to the edge of the foammember 138. This configuration permits air passing into the cavity 76 toexit the sole structure 130 by passing laterally through the channelportion 77 and then upward and/or outward away from the foam member 138.FIG. 28 shows a schematic cross-section of this configuration, witharrows illustrating the flow of air. The configuration illustrated inFIGS. 3-5, 28, and 30 permits air flow out of the vent 72, and possiblyback into the vent 72, while resisting migration of debris (e.g. dirt,fibers, etc.) and moisture from migrating to and through the vent 72.The combined downward, lateral, and upward paths that the air must passthrough to travel to and from the vent 72 acts to resist this migration,and debris will often become trapped near the distal end 78 of thecavity 76, much like a drain trap in a plumbing application.

In another embodiment, the distal end 78 may stop at a point within thefoam member 138 and still outside the peripheral boundary of the insert37, which allows the air to vent upward out of the cavity 76 at thedistal end 78 and provides the same or similar functionality. FIGS.36-38 and 47 illustrate an example embodiment of this configuration. Itis understood that the foot contacting member 133 in the embodiments ofFIGS. 36-38 and 47 may include passages positioned around the distalends 78 of the cavities 76 to allow air passage through the footcontacting member 133, such as the passages 79 shown in FIGS. 28 and 30.In a further embodiment, at least a portion of the channel portion 77may be a tunnel within the foam member 138, rather than a slit. In sucha configuration, the channel portion 77 may have a tunnel portion and anopen portion that permits air passing through the tunnel to vent upward,or the tunnel portion may extend all the way to the edge of the foammember 138 to permit sideways venting. FIG. 29 shows a cross-section ofan alternate embodiment, where the foam member 138 contains a cavity 76but no channel portion 77.

Additionally, the foot contacting member 133 includes one or morepassages 79 extending through the foot contacting member 133 located atthe distal end 78 of the cavity 76, in the embodiment of FIGS. 3-5, 28,and 30. As shown in FIGS. 28 and 30, the passages 79 may be pinhole-typepassages 79 that extend vertically through the foot contacting member133. In another embodiment, a different type of passage 79 may be used,including slits or grooves, and at least one passage 79 may extendlaterally to a side of the foot contacting member 133, rather thanupward through the thickness of the foot contacting member 133. Thepassages 79 allow the air exiting through the vent 72 and outwardthrough the cavity 76 to pass through the foot contacting member 133 andout of the sole structure 130. In another embodiment, the footcontacting member 133 may not include any passage(s) 79. The footcontacting member 133 may still provide ventilation in a configurationwithout any passage(s) 79, such as by using a breathable foam or otherbreathable material for constructing the foot contacting member 133.

As described above, in one embodiment, the insert 37 may have one ormore filters 73 that at least partially cover the vent(s) 72, as seen inFIGS. 22B and 28-29. The filter 73 may be considered to be a selectivelypermeable closure that covers the vent 72, which at least allows passageof air out of the vent 72 and resists passage of certain undesirablesubstances into the vent. For example, in the embodiment of FIGS. 3-22B,28, and 30, the filter 73 is a selectively permeable closure thatpermits inward and outward flow of air, and also permits outward flow ofmoisture, while resisting the inward flow of moisture and/or particles.One type of filter 73 that may achieve this function is a fluoroplasticporous membrane, for example, a porous membrane comprising PTFE (i.e.Teflon) fibers. Such a porous membrane may be a 10 μm to 100 μm thickporous membrane in one embodiment. In a filter 73 including PTFE fibers,the high surface energy of the PTFE causes water to ball up on thesurface of the filter 73, rather than penetrating. The filter 73 mayalso have an adhesive on one side to permit the filter 73 to beconnected to the insert 37, and may further have another materialconnected to either the inward or outward facing side, such as apolyester material to provide shear strength for the porous membrane. Inthe embodiment shown in FIGS. 3-22B, 28, and 30, the filter 73 isadhesively attached to the bottom side of the second layer 68 around theperiphery of the vent 72 to cover the vent 72. The bottom layer 69includes apertures 74 that are significantly larger than the vents 72,in order to allow the filters 73 to be adhesively attached to the secondlayer 68, in the embodiment of FIGS. 3-22B, 28, and 30. In otherembodiments, a different type of filter 73 may be used, and/or thefilter 73 may be connected to the insert 37 in another manner. In afurther embodiment, no filter 73 may be used.

FIGS. 36-44 illustrate a sensor system 412 with an insert 437 thatincludes an airflow system 70 with a different arrangement of channels71 and vents 72 than the insert 37 described above and shown in FIGS.3-22B. FIGS. 22C-D and FIGS. 45-47 illustrate additional embodiments ofinsert members 37′, 537 that include an airflow system 70 with achannels 71 and vents 72 arranged similarly to the insert 437 of FIGS.36-44. The positions of the sensors 16 a-d in the embodiment of FIGS.22C-D are generally the same as in the embodiment of FIGS. 3-22B, 28,and 30, and are illustrated in broken lines on the spacer layer 67 inFIG. 22C. Such structural features are not described again herein forthe sake of brevity. In the embodiment of the insert 437 in FIGS. 36-44,the first phalangeal sensor 16 a and the first metatarsal sensor 16 bare connected to the same vent 72 by channels 71 in substantially thesame configuration described above. The fifth metatarsal sensor 16 c andthe heel sensor 16 d also share a common vent 72, which is located inthe fifth metatarsal area of the insert 437, rather than in the heelportion as in the embodiment of FIGS. 3-22B, 28, and 30. In thisconfiguration, the heel sensor 16 d has a channel 71 that extends fromthe hole 43 at the heel sensor 16 d to the hole 43 at the fifthmetatarsal sensor 16 c, and another channel 71 extends from the fifthmetatarsal sensor 16 c to the vent 72. As shown in FIGS. 36-44, thelocations of the vents 72 are different from the embodiment describedabove, and accordingly, the insert 437 may be used with a sole structure130 that contains features specifically adapted for vents 72 in theselocations. FIGS. 36-38 illustrate a sole structure 130 and a foam member138 that includes cavities 76 positioned for cooperation with the vents72 of the insert 437. These cavities 76 function similarly to thecavities 76 of the embodiment shown in FIGS. 3-5 and described herein.For example, the foam member 138 has a cavity 76 in the fifth metatarsalarea of the sole structure 130 extending forward beyond the peripheraledge of the insert 437 in order to provide venting of air from the vent72 in the fifth metatarsal area of the insert 437. The foam member 138also has a cavity 76 in the first metatarsal area of the sole structure130 extending rearward beyond the peripheral edge of the insert 437 inorder to provide venting of air from the vent 72 in the first metatarsalarea of the insert 437. The inserts 37′, 537 of FIGS. 22C-D and 45-47may utilize foam members 138 with cavities 76 positioned in similarlocations in various embodiments. It is understood that differentpositions and configurations of cavities 76 may be utilized in otherembodiments. In a further embodiment, a single sole structure 130 maycontain multiple cavities 76 arranged for use with several differenttypes of inserts 37, 37′, 437, 537 having different vent 72 locations.In this embodiment, at least some of the cavities 76 may be unused,depending on the configuration of the insert 37, et seq. In furtherembodiments, any of the features, characteristics, etc., of theembodiments of airflow systems 70 described herein may be combined withother embodiments of airflow systems 70, as well as other embodiments ofsensor systems 12, inserts 37, and/or footwear 100.

In the embodiment of FIGS. 3-22B, as described above, the spacer layer67 generally insulates conductive members/components on the first andsecond layers 66, 68 from each other, except in areas where electricalcontact is desired, such as at the pathway 50 and between the contacts40, 42 of the sensors 16. The spacer layer 67 has holes 38, 43 to defineareas of desired electrical contact between the layers 66, 68. Thecomponents of the airflow system 70, in particular the channels 71 mayprovide a route for shorting or other undesired electrical contact byone or more conductive members between the first and second layers 66,68. In one embodiment, the sensor system 12 may include one or morepatches of dielectric material 80 to resist or prevent undesiredshorting by one or more conductive members across open areas of thespacer layer 67, such as the channels 71. This dielectric material 80may be in the form of an acrylic ink or other UV-curable ink, or anotherinsulating material suitable for the application. In the embodimentshown in FIGS. 16-17, the insert 37 has several patches of dielectricmaterial 80 extending across the channel 71, to insulate thedistribution leads 18A located around the sensor contacts 40, 42 fromeach other. As shown in FIGS. 16-17, the dielectric material 80 isconnected to the top side of the second layer 68 and covers thedistribution lead 18A, although in another embodiment, the dielectricmaterial 80 may be connected to the first layer 66, 68, or both layersmay have the dielectric material 80. The spacer layer 67 may have adielectric “bridge” over the channel 71 in a further embodiment.Additionally, the dielectric material completely covers a portion of thedistribution lead 18A and is wider than the width of the channel 71,which compensates for movement or displacement of the spacer layer 67 ordifferences in manufacturing tolerances. In this embodiment, the insert37 has patches of the dielectric material 80 located at eachintersection of one of the channels 71 with the distribution leads 18A,including one patch 80 on the rear side of the first phalangeal sensor16 a, two patches 80 on the front and rear ends of the first metatarsalsensor 16 b, one patch 80 on the rear side of the fifth metatarsalsensor 16 c, and one patch 80 on the front side of the heel sensor 16 d.In other embodiments, the insert 37 may have patches of the dielectricmaterial located elsewhere on the insert 37, to insulate other portionsof the distribution leads 18A or other conductive members from shortingbetween the layers 66, 68. It is understood that a spacer layer 67having a different configuration with holes, apertures, openings, etc.that are differently shaped and/or located may give rise to the use ofthe dielectric material 80 in other locations for insulation purposes.As discussed herein, the dielectric material 80 may be used in otherplaces as a reinforcement or stiffening material.

In the embodiment of FIGS. 3-22B, the port 14, the sensors 16, and theleads 18 form a circuit 10 on the insert member 37. The port 14 has aplurality of terminals 11, with four terminals 11 each dedicated to oneof the four sensors 16 individually, one terminal 11 for applying avoltage to the circuit 10, and one terminal 1 for voltage measurement.In this embodiment, the sensor system 12 also includes a pair ofresistors 53, 54, each located on one of the layers 66, 68, and apathway 50 connecting the circuitry on the first layer 66 with thecircuitry on the second layer 68. The resistors 53, 54 provide areference point for the module 22 to measure the resistance of eachsensor 16, and permit the module 22 to convert the variable current fromthe active sensor 16 into a measurable voltage. Additionally, theresistors 53, 54 are arranged in parallel within the circuit 10, whichcompensates for variations in the circuit 10 and/or variations in themanufacturing processes used to create the resistors 53, 54, such asvariations in conductivity of the inks used to print the leads 18 and/orthe sensor contacts 40, 42. In one embodiment, the equivalent resistanceof the two resistors 53, 54 is 1500+/−500 kΩ. In another embodiment, asingle resistor 53, 54 or two resistors 53, 54 in series could be used.In a further embodiment, the resistors 53, 54 may be positionedelsewhere on the insert 37, or may be located within the circuitry ofthe module 22. A more technical depiction of the circuit 10 of thisembodiment is described below and shown in FIG. 20.

FIG. 20 illustrates a circuit 10 that may be used to detect and measurepressure in accordance with an embodiment of the invention. The circuit10 includes six terminals 104 a-104 f, including a power terminal 104 afor applying a voltage to the circuit 10, a measurement terminal 104 bfor measuring a voltage as described below, and four sensor terminals104 c-104 f, each of which is dedicated to one of the sensors 16 a-16 dindividually, and each of which represents ground in this embodiment.The terminals 104 a-104 f represent the terminals 11 of the port 14. Inthe embodiment shown, fixed resistors 102 a and 102 b, which representresistors 53 and 54, are connected in parallel. Fixed resistors 102 aand 102 b may be physically located on separate layers. The equivalentresistance across terminals 104 a and 104 b is determined by thewell-known equation of:

R _(eq) =R _(102a) *R _(102b)/(R _(102a) +R _(102b))   (Equation 1)

Where:

-   -   R_(102a)=Resistance of fixed resistors 102 a    -   R_(102b)=Resistance of fixed resistors 102 b    -   R_(eq)=Equivalent resistance

Electrically connecting fixed resistors 102 a and 102 b in parallelcompensates for variations in the manufacturing processes used to createfixed resistors 102 a and 102 b. For example, if fixed resistor 102 ahas a resistance that deviates from a desired resistance, the deviationof the equivalent resistance determined by equation 1 is minimized bythe averaging effect of fixed resistor 102 b. One skilled in the artwill appreciate that two fixed resistors are shown for illustrationpurposes only. Additional fixed resistors may be connected in paralleland each fixed resistor may be formed on a different layer.

In the embodiment shown in FIG. 20, fixed resistors 102 a and 102 b areconnected to sensors 16 a-16 d. Sensors 16 a-16 d may be implementedwith variable resistors that change resistance in response to changes inpressure, as described above. Each of sensors 16 a-16 d may beimplemented with multiple variable resistors. In one embodiment, each ofsensors 16 a-16 d is implemented with two variable resistors which arephysically located on different layers and electrically connected inparallel. For example, as described above with respect to oneembodiment, each sensor 16 a-16 d may contain two contacts 40, 42 thatengage each other to a greater degree as applied pressure increases, andthe resistance of the sensor 16 a-16 d may decrease as the engagementincreases. As mentioned above, connecting resistors in parallel createsan equivalent resistance that minimizes deviations created duringmanufacturing processes. In another embodiment, the contacts 40, 42 maybe arranged in series. Sensors 16 a-16 d may be connected to ground viaswitches 108 a-108 d. Switches 108 a-108 d may be closed one at a timeto connect a sensor. In some embodiments, switches 108 a-108 d areimplemented with transistors or integrated circuits.

In operation a voltage level, such as 3 volts, is applied at terminal104 a. Switches 108 a-108 d are closed one at a time to connect one ofsensors 16 a-16 d to ground. When connected to ground, each of sensors16 a-16 d forms a voltage divider with the combination of fixedresistors 102 a and 102 b. For example, when switch 108 a is closed, thevoltage between terminal 104 a and ground is divided between thecombination of fixed resistors 102 a and 102 b and sensor 16 a. Thevoltage measured at terminal 104 b changes as the resistance of sensor16 a changes. As a result, pressure applied to sensor 16 a may bemeasured as a voltage level at terminal 104 b. The resistance of thesensor 16 a is measured utilizing the voltage applied to the sensor 16 ain series with the combined fixed resistors 104 a and 104 b of knownvalue. Similarly, selectively closing switches 108 b-108 d will generatevoltage levels at terminal 104 b that are related to the pressureapplied at sensors 16 b-16 d. It is understood that the connectionsbetween the sensors 16 a-d and the terminals 104 c-f may be different inother embodiments. For example, the sensors 16 a-d are connected todifferent pins of the interface 20 in the left shoe insert 37 ascompared to the right shoe insert 37, as shown in FIG. 12. In anotherembodiment, the voltage level may be applied in the opposite manner,with the ground located at terminal 104 a and the voltage applied atterminals 104 c-f. In further embodiments, another circuit configurationmay be used to achieve a similar result and functionality.

The two resistors 53, 54 have similar or identical structures in theembodiment illustrated, however it is understood that the resistors mayhave different structures in other embodiments. Each resistor 53, 54 hastwo sections 55, 56 spaced from each other and a bridge 57 positionedbetween and connecting the sections 55, 56. FIGS. 15 and 17 illustratemore detailed views of the resistors 53, 54, with one resistor 53 shownfrom the top and the other resistor 54 shown from the underside. Thesections 55, 56 may be connected to different leads 18, such that anelectronic signal or current that enters the resistor 53, 54 through onelead 18 would travel between the sections 55, 56 across the bridge 57,and then exit through the other lead 18. The sections 55, 56 may beformed as an inner section 55 and an outer section 56 that substantiallysurrounds the inner section 55, to provide a large length fortransmission between the sections 55, 56 within a small area. In thisembodiment, the bridge 57 also substantially surrounds the inner section55 and is substantially surrounded by the outer section 56. As seen andappreciated in FIGS. 15-17, the bridge 57 overlaps partially with boththe inner section 55 and the outer section 56, in order to permittransmission through the bridge 57. In the embodiment of FIGS. 15 and17, the inner section 55 is formed in a circular or substantiallycircular shape. The outer section 56 is at least partially formed by asemi-annular ring shape that at least partially surrounds the innersection 55 and is spaced from the inner section around the inner edge ofthe ring, in this embodiment. The bridge 57 in this embodiment is alsoat least partially formed by a semi-annular ring shape with inner andouter semi-circular edges, and the bridge 57 at least partiallysurrounds the inner section 55 and at least partially fills the spacesbetween the sections 55, 56. The inner edge of the bridge 57 overlapsthe inner section 55 and the outer edge of the bridge 57 overlaps theouter section 56, as illustrated in FIG. 17. Additionally, in thisembodiment, a gap 58 is defined through the outer section 56 and thebridge 57 to permit the lead 18 to connect to the inner section 55 andpass away from the inner section 55 without contacting the outer section56 or the bridge 57. In other words, the semi-annular ring-shaped outersection 56 and bridge 57 have ends that define the gap 58 therebetween.It is understood that the relative shapes, sizes, and arrangements ofthe sections 55, 56 and the bridge 57 may be different in otherembodiments.

In one embodiment, the bridge 57 may be formed of a more resistivematerial than the sections 55, 56, and may thus provide the majority ofthe resistance of each resistor 53, 54. The sections 55, 56 may be atleast partially formed of a high-conductivity material, such as a silvermaterial. In the embodiment illustrated in FIGS. 3-22B, the inner andouter sections 55, 56 are formed of the same material as the leads 18,such as a printed silver-based or other metallic-based ink. In thisembodiment, the bridge 57 is formed of the same material as the sensorcontacts 40, 42, such as carbon black or another conductive carbonmaterial. It is understood that the inner and outer sections 55, 56and/or the bridge 57 may be formed of different materials in otherembodiments.

The pathway 50 generally permits continuous and/or uninterruptedelectrical communication and passes electronic signals between the firstand second layers 66, 68. In the embodiment of FIGS. 3-22B, the port 14is directly connected to the second layer 68, and the pathway 50 mayserve as a vertical path between the port 14 and the sensor contacts 40on the first layer 66, 68. In this embodiment, the pathway 50 includesconductive portions 51 on the first layer 66 and the second layer 68,such that conductive portions 51 are in continuous engagement with eachother to provide continuous electrical communication between the firstand second layers 66, 68 (See, e.g., FIG. 21). The spacer layer 67 inthis embodiment includes a hole 38 that is aligned with the pathway 50and allows for continuous engagement between the conductive portions 51through the spacer layer 67. Additionally, in the embodiment of FIGS.3-22B, each of the conductive portions 51 is divided into two sections52 that are separated by an elongated gap 59 (FIG. 15). These conductivesections 52 have substantially half-circular shapes in the embodimentshown in FIGS. 3-22B, and the conductive portions 51 have a generallycircular shape. The sections 52 on the first layer 66 are shaped, sized,and located substantially the same as the sections 52 on the secondlayer 68, such that the sections on each layer 66, 68 engage thecorresponding sections 52 on the other layer 66, 68. The gaps 59 on thetwo layers 66, 68 are also substantially aligned in this embodiment. Inother words, the conductive portions 51 may be arranged so that the leftsections 52 of the conductive portions 51 engage each other and theright sections 52 of the conductive portions 51 engage each other, withno direct engagement between either of the left sections 52 and eitherof the right sections 52. This configuration may alternately bedescribed as creating two separate, side-by-side pathways between thefirst and second layers 66, 68, and each section 52 may be considered tobe separate conductive portions forming each pathway. The conductiveportions 51 of the pathway 50 are formed of a conductive material, andin one embodiment, the conductive portions 51 may be formed of the samematerial as the leads 18, such as a silver-based ink or other metallicink. In other embodiments, the pathway 50, and the components thereofdescribed herein, may have a different size, shape, form, or location,and may be formed of a different material.

The pathway 50 may be at least partially surrounded by or bounded by astiffening structure 60 in one embodiment to provide structural supportand/or effects. As illustrated in FIGS. 7-17 and 21, the conductiveportions 51 are surrounded by a substantially annular stiffener 60. Thestiffener 60 in this embodiment is not completely annular, as the gap 59extends through the stiffener 60, and the stiffener 60 may also includeadditional gaps for leads 18 to pass through and connect to theconductive portions 51, in another embodiment. The stiffener 60 in thisembodiment serves to assist with engagement between the conductiveportions 51, to achieve maximum engagement between the conductiveportions 51. FIG. 21 illustrates this configuration in greater detail.It is understood that FIG. 21 is at least partially schematic in nature,and the relative sizes of the components shown in FIG. 21 may beexaggerated for effect and understanding. Additionally, FIG. 21 does notshow the bottom layer 69, for clarity in illustrating the other layers66, 67, 68. In general, the spacer layer 67 provides separation betweenthe conductive portions 51, such that the layers 66, 68 must bedeflected toward each other at the pathway 50 in order for theconductive portions 51 to engage each other.

In the embodiment shown in FIG. 21, the hole 38 in the spacer layer 67permits the conductive portions 51 to deflect toward each other andengage each other. The first and second layers 66, 68 may be vacuumed orotherwise pressed together to achieve this contact, such as by passing aroller over the assembled insert 37 at the location of the pathway 50 toremove excess air. The deflection of the layers 66, 68 toward each othercreates an annular transition region 61 on one or both of the layers 66,68 around the rim of the hole 38, where the layer or layers 66, 68deflect toward each other. The transition region 61 in this embodimentis defined by an outer annular break line 61 a and an inner annularbreak line 61 b, with the transition region 61 between the break lines61 a, 61 b, and with the conductive portions 51 within the inner breakline 61 b. In this configuration, the first and second layers 66, 68 aregenerally horizontal outside the outer break line 61 a and within theinner break line 61 a, and the first and second layers 66, 68 slopetoward each other at the transition region 61 to create engagementbetween the conductive portions 51. The hole 38 is larger in dimensionthan the stiffener 60, such that the stiffener 60 is positioned adjacentthe edge of the hole 38. In this configuration, the increased stiffnessof the stiffener 60 tends to cause the layers 66, 68 to make a sharptransition from horizontal to at least partially vertical at thelocation of the stiffener 60, and thus the stiffener 60 tends to definethe transition region 61.

As seen in FIG. 21, the location of the transition region 61 at thestiffener 60 permits maximum contact between the conductive portions 51inside the area 62 bounded by the transition region 61. In oneembodiment, majorities of the conductive portions 51 are in continuousengagement with each other through the hole 38 inside an area 62 boundedby the transition region 61. In another embodiment, the conductiveportions 51 are in continuous engagement with each other through thehole 38 over the entirety or substantially the entirety of the area 62bounded by the transition region 61. This continuous contact assists inensuring that the pathway 50 and the circuit 10 will be uninterruptedand will function properly. Adhesives may be utilized at or around thepathway 50 to enhance the engagement between the layers 66, 68 at thepathway 50. The stiffener 60 may be formed of any material that hassuitable stiffness, and in one embodiment, may be formed of a materialwith greater stiffness than the material of the conductive portions 51.One example of such a material is carbon black or other carbon-basedmaterial, although other materials may be used in other embodiments,including other types of printable substances.

The stiffener 60 may also assist in achieving continuous engagementbetween the conductive portions 51 in a different way. In the embodimentof FIGS. 3-22B, the stiffener 60 is formed by a carbon-based ink that ismore absorptive of many wavelengths of light as compared to themetallic-based ink of the conductive portions 51, which may tend to bereflective. The ink on the layers 66, 68 may be cured using IRradiation, and in this embodiment, the stiffener 60 may absorb a greateramount of the IR radiation than the conductive portions 51. Thisabsorption may tend to heat the area of the layer 66, 68 immediatelybelow the stiffener 60 to cause a temperature gradient across thethickness of the layer 66, 68, such that the layer 66, 68 is warmer onthe surface on which the stiffener 60 is printed and cooler on theopposite surface. This temperature gradient, in turn, may causedifferential expansion/contraction at the opposed surfaces of the layer66, 68 around the stiffener 60, such that the warmer surface at thestiffener 60 may contract relative to the surface opposite the stiffener60, causing the region of each layer 66, 68 inside the stiffener 60(i.e. at the conductive portions 51) to protrude or dimple slightlyupward. This protrusion of the layers 66, 68 extends the conductiveportions 51 on the layers 66, 68 closer to each other, which may resultin increased engagement between the conductive portions 51, assisting inachieving continuous or substantially continuous engagement of theconductive portions 51 within the stiffener 60. The protrusion of thelayers 66, 68 may additionally or alternately be enhanced by mechanicalstamping or other pre-straining action to create a protruding ordimpling effect. Bonding techniques, such as ultrasonic spot welding orother spot welding, may additionally or alternately be used increaseengagement between the conductive portions 51. In one embodiment,ultrasonic spot welding may be used in a waffle pattern between theconductive portions 51 to retain the conductive portions 51 inengagement with each other.

The gap 59 in the pathway 50 may serve multiple functions. One functionthat may be served by the gap 59 is to create electrical separationbetween the sections 52 of the pathway 50, in order to create separateconnections between the layers 66, 68. Another function that may beserved by the gap 59 is to increase the durability of the pathway 50during flexing of the insert 37. In general, the foot of the user willtend to “roll” from the fifth metatarsal area (also referred to as thefifth metatarsal head area or the fifth metatarsophalangeal area) to thefirst metatarsal area (also referred to as the first metatarsal headarea or the first metatarsophalangeal area). In the embodiment of FIGS.3-22B, the pathway 50 is located around the second and/or thirdmetatarsal areas of the insert 37, so that the roll of the user's footpasses directly over the pathway 50. Repeated rolling of this nature cancause bending of the conductive portions 51, which can in turn, causeabrasion, fracture, separation, etc. The gap 59 can serve as a flexingpoint to minimize bending of the conductive portions 51 if alignedproperly. In the embodiment of FIGS. 3-22B, the gap 59 is generallyaligned perpendicular to the direction of the typical roll of the user'sfoot, or in other words, perpendicular to a line extending between thefifth metatarsal area and the first metatarsal area of the insert 37. Inone embodiment, a virtual line L (see FIG. 10) may be drawn between thesensor 16 b in the first metatarsal area and the sensor 16 c in thefifth metatarsal area, and the gap 59 may be aligned perpendicular tothis line L or within +/−45° of being perpendicular to the line L. Theline L as shown in FIG. 10 is drawn between the front edge (e.g. frontcenter) of the first metatarsal sensor 16 b and the rear edge (e.g. rearcenter) of the fifth metatarsal sensor 16 c. In other embodiments, thegap 59 (if present) may be positioned differently, particularly if thepathway 50 is located in a different area of the insert 37.

FIGS. 52-56 illustrate another embodiment of a sensor system 612 thatincludes an insert member 37, which are similar to the sensor system 12and the insert 37 of FIGS. 3-22B. In the embodiment of FIGS. 52-56, thepathway 50 does not include a stiffener 60 as in the embodiment of FIGS.3-22B. Additionally, the conductive portions 51 of the pathway 50 inthis embodiment are enlarged to cover the area that is covered by thestiffener 60 in the embodiment of FIGS. 3-22B. In other words, in thisembodiment, the conductive portions 51 extend almost to the edge of thehole 38 that is aligned with the pathway 50, and portions of theconductive portions 51 are positioned within the transition region 61,as illustrated schematically in FIG. 56. The increased sizes of theconductive portions 51 in the embodiment of FIGS. 52-56 may provide agreater surface area for potential engagement between the conductiveportions 51, and thereby provide more consistent and uninterruptedfunction of the pathway 50. In other respects, the pathway 50 sharesstructural and functional features with the embodiments of the pathway50 shown in FIGS. 3-22B and described elsewhere herein. Such similarstructures and functions are not described again for the sake ofbrevity. In one embodiment, mechanical stamping or other pre-strainingaction can be used to create a protruding or dimpling effect of thelayers 66, 68, enhancing engagement between the conductive portions 51,as described above. Bonding techniques, such as ultrasonic spot weldingor other spot welding, may additionally or alternately be used increaseengagement between the conductive portions 51, as also described above.

In another embodiment, the pathway 50 may be positioned in anotherlocation or have another configuration. For example, in one embodiment,the pathway 50 may be formed at or near the terminals 11, such as byutilizing a two-pin connection (not shown) on the first layer 66 andconnecting the two-pin connection to the fifth and sixth terminals 11 ofthe interface 20, such as by a crimping connection. Other structures forforming a pathway 50 may be utilized in further embodiments.

FIGS. 48-51 illustrate another embodiment of a sensor system 712 that isconfigured differently than the sensor systems 12, 412, 512, 612described herein and has a different mode of operation compared to thesensor systems 12, 412, 512, 612 described herein. The sensor system 712of FIGS. 48-51 includes many structural and functional features incommon with the sensor system 12 described above and shown in FIGS.3-22B. For example, the external shape of the insert 37, the generalpositions of the sensors 16, and the configuration of the airflow system70 in the embodiment of FIGS. 48-51 are similar or identical to theshape of the insert 37, the general positions of the sensors 16, and theconfiguration of the airflow system 70 in FIGS. 3-22B. These and othersuch common features may not be described again herein for the sake ofbrevity.

In the embodiment of FIGS. 48-51, the sensor system 712 has sensors 16that include two contacts or electrodes 740, 742 positioned on thesecond layer 68 and a third contact 744 positioned on the first layer66. In this embodiment, all the contacts 40, 742, 744 are formed of acarbon-based ink as described above, having one or more distributionleads 18A at the edges of each of the contacts 740, 742, 744. Thecontacts 740, 742 on the second layer 68 may have a differentconductivity than the contacts 744 on the first layer 66, and may beformed of a carbon-based ink that is doped to achieve higherconductivity. The contacts 740, 742 on the second layer 68 areelectrically separate from each other and are each connected to the port14 by leads 18. A single power or ground lead 18B connects to a firstcontact 740 of all of the sensors 16, and the second contact 742 of eachindividual sensor 16 is connected by an individual lead 18 to the port14.

The structures of the sensors 16 in the sensor system 712 of FIGS. 48-51are otherwise similar to the sensors 16 in the embodiment of FIGS.3-22B. In this embodiment, the combined first and second contacts 740,742 are structured similarly to the contact 42 on the second layer 68 ofthe embodiment of FIGS. 3-22B, except that the first and second contacts740, 742 are electrically separate from each other and the third contact744 is structured similarly to the contact 40 on the first layer 66 inthe embodiment of FIGS. 3-22B. In other embodiments, the sensors 16and/or the contacts 740, 742, 744 may have different configurations. Forexample, in one embodiment, the contact 744 on the first layer 66 may bea single patch of the carbon-based ink.

In the embodiment of the sensor system 712 in FIGS. 48-51, the first andsecond contacts 740, 742 are electrically separate from each other, andthe third contact 744 is in confronting relation to the first and secondcontacts 740, 742, such that the third contact 744 engages the first andsecond contacts 740, 742 upon application of vertical pressure to thesensor 16. In this configuration, the signals from the port 14 travelbetween the two electrodes 740, 742 of each sensor 16 on the secondlayer 68 by passing through the electrode 744 of that sensor 16 on thefirst layer 66. Accordingly, the resistivity of the sensor 16 isdetermined by the engagement between the contacts 740, 742 on the secondlayer 68 and the electrode 744 on the first layer 66, and therelationship between the pressure applied to the sensor 16 and theresistance of the sensor 16 is similar to that of the sensors 16 of theembodiment in FIGS. 3-22B described herein and shown in FIG. 27. Thesensitivity range, activation pressure, and other functional propertiesof the sensors 16 of FIGS. 48-51 may also be similar to those of thesensors 16 of the sensor system 12 in FIGS. 3-22B.

The connections at the port 14 in the sensor system 712 of FIGS. 49-51are similar to those in the embodiment of FIGS. 3-22B and illustratedschematically in FIG. 20, including a power terminal 104 a, ameasurement terminal 104 b, and four sensor terminals 104 c-f.Resistivity/resistance measurements may be completed in the same or asimilar manner as described above. The circuit in the embodiment ofFIGS. 48-51 is similar to that shown in FIG. 20, however this embodimentincludes only a single fixed resistor 53, rather than two fixedresistors 53, 54 in parallel as in the embodiment of FIGS. 3-22B.Additionally, each sensor 16 in the embodiment of FIGS. 3-22B may beconsidered to be five resistors in parallel, while each sensor 16 in thesensor system 712 of FIGS. 49-51 may be considered to be two resistorsin parallel (contact 742) arranged in series with three additionalresistors in parallel (contact 740). In another embodiment, the sensorsystem 712 of FIGS. 48-51 may be wired to have two fixed resistors inparallel or any other resistor configuration described herein. It isunderstood that because the leads 18 connected to the port 14 exist ononly the second layer 68, no pathway 50 between the layers 66, 68 isnecessary in this embodiment. Accordingly, the spacer layer 67 in thesensor system 712 of FIGS. 48-51 may not contain the hole 38 as in thespacer layer 67 of FIGS. 3-22B.

The insert 37 may be constructed by depositing the various components ona polymer (e.g. PET) film. In one embodiment, the insert 37 isconstructed by first depositing the conductive metallic material on eachlayer 66, 68, such as by printing in the traced pattern of the leads 18(including the distribution lead 18A, the conductive portions 51 of thepathway 50, the inner and outer sections 55, 56 of the resistors 53, 54,etc. The additional carbon material can then be deposited on each layer66, 68, such as by printing, to form the contacts 40, 42, the stiffener60 of the pathway 50, the bridge 57 of the resistors 53, 54, etc. Anyadditional components can then be deposited, such as any dielectricportions. The layers 66, 68 may be printed on PET sheets and then cutout to form the outer peripheral shape after printing in one embodiment.

The port 14 is configured for communication of data collected by thesensors 16 to an outside source, in one or more known manners. In oneembodiment, the port 14 is a universal communication port, configuredfor communication of data in a universally readable format. In theembodiments shown in FIGS. 3-22B, the port 14 includes an interface 20for connection to an electronic module 22, shown in connection with theport 14 in FIG. 3. Additionally, in this embodiment, the port 14 isassociated with the housing 24 for insertion of the electronic module22, located in the well 135 in the middle arch or midfoot region of themidsole 131. As illustrated in FIGS. 7-16, the sensor leads 18 convergetogether to form a consolidated interface 20 at their terminals 11, inorder to connect to the port 14. In one embodiment, the consolidatedinterface may include individual connection of the sensor leads 18 tothe port interface 20, such as through a plurality of electricalcontacts. In another embodiment, the sensor leads 18 could beconsolidated to form an external interface, such as a plug-typeinterface or another configuration, and in a further embodiment, thesensor leads 18 may form a non-consolidated interface, with each lead 18having its own separate terminal 11. As also described below, the module22 may have an interface 23 for connection to the port interface 20and/or the sensor leads 18.

In the embodiment shown in FIGS. 3-22B, the interface 20 takes the formof electrical contacts or terminals 11. In one embodiment, the terminals11 are formed on a tongue or extension 21 that extends from one of thelayers 66, 68 into the hole 27 provided for the housing 24. Theextension consolidates the ends of the leads 18 to a single area to formthe interface 20. In the embodiment of FIGS. 3-22B, the extension 21extends from the second layer 68 into the hole 27, and is bent downwardwithin the housing 24 to place the terminals 11 within the housing 24and make the interface 20 accessible within the housing 24. The secondlayer 68 further has slits 83 on both sides of the extension 21 in thisembodiment, to increase the length of the extension 21 and permit theextension 21 to be bent downwardly and extend down into the housing 24.The rounded ends of the slits 83 can resist formation and/or propagationof cracks and tears in the material of the second layer 68 around theextension 21. The extension 21 may pass underneath the flange 28 of thehousing 24 and through a slot or other space underneath the lip 28 inorder to extend into the housing 24. When the flange 28 is a separatepiece, such as in the embodiment shown in FIGS. 31-32, the extension 21may be inserted between the flange 28 and the tub 29 before the flange28 is connected to the tub 29. In the embodiment shown in FIGS. 3-22B,the extension 21 is formed of the same polymeric film material as thesecond layer 68 and is integral (e.g. formed as a single piece) with thesecond layer 68. In other embodiments, the extension 21 may extend fromthe first layer 66, may include portions connected to both layers 66,68, and/or may be formed of a separate piece that is connected to one orboth layers.

The extension 21 as illustrated in FIGS. 3-22B and 32 has a reinforcingmaterial 81 that is connected to the extension to reinforce a portion ofthe extension 21. This reinforcing material 81 may be selected from anumber of different materials that provide strength, stiffness, wearresistance, and other reinforcement. For example, the reinforcingmaterial 81 may be formed of the same material as the dielectricmaterial 80 used to insulate between the layers 66, 68 at the channels71, such as an acrylic ink or other UV-curable ink. In the embodimentillustrated in FIGS. 3-22B and 32, the reinforcing material 81 is in theform of an elongated strip that extends across the entire width of theextension 21 midway along the length of the extension 21. The extension21 in this embodiment extends from the second layer 68 into the hole 27,and the reinforcing material 81 is deposited on the top side of theextension 21, extending over and across the ends of the leads 18. Thereinforcing material 81 may have a stiffness that is greater than thestiffness of the material of the leads 18 in one embodiment, and mayalso have a greater stiffness than the film material forming the layers66, 68 in another embodiment.

In the configuration illustrated in FIGS. 3-22B and 32, the extension 21bends downwardly into the well 135 and into the housing 24, as discussedabove, to place the terminals 11 within the housing 24 and forming theinterface 20 within the housing 24. As shown in FIG. 32, the extension21 has a bend area 84 where the extension 21 bends downwardly at theperipheral edge of the housing 24, to extend downwardly along the sidewall 25 of the housing 24. The bend area 84 is generally linear andextends transversely across the extension 21. In the embodimentillustrated, the reinforcing material 81 is located on the extension 21such that the strip of reinforcing material 81 extends transverselyacross the extension 21 at the bend area 84 and generally parallel tothe bend area 84. In one embodiment, the reinforcing material 81 isformed as an elongated rectangular strip and has a width that issufficient so that the reinforcing material 81 covers the entire bendarea 84. In this position, the reinforcing material 81 serves severalfunctions. One such function is protecting the leads 18 and/or the filmof the extension 21 from damage due to the bending of the extension 21.Another such function is protecting the leads 18 and/or the film of theextension 21 from wear and abrasion at the bend area 84, such as fromrubbing against the housing 24 at that location. A further such functionis to add stiffness and/or strength to the extension 21. Other benefitsof the reinforcing material 81 may be apparent to those skilled in theart. It is understood that, in other embodiments, the reinforcingmaterial 81 may be positioned, shaped, or configured differently, or thereinforcing material 81 may additionally or alternately be used in adifferent location to impart strength, stiffness, wear resistance, etc.to another component of the sensor assembly 12. In a further embodiment,no reinforcing material 81 may be used, or the majority of the extension21 may be covered by the reinforcing material 81.

The housing 24 may contain connection structure, such as connector pinsor springs (not shown) for establishing connection between the interface20 and the module 22. In one embodiment, the port 14 includes anelectrical connector 82 forming the interface 20, which may includecontacts that individually attach to the terminals 11, as mentionedabove and shown in FIG. 32. The connector 82 may connect to theextension 21 and the terminals 11 via a crimping connection. Theinterface 20 in this embodiment includes seven terminals: four terminals11 each individually connected to one of the sensors 16, one terminal 11serving as the measurement terminal (104 b in FIG. 20), and one terminalserving as a power terminal (104 a in FIG. 20) to apply a voltage to thecircuit 10. As discussed above, the power terminal may instead beconfigured as a ground terminal in another embodiment, with the sensorterminals (104 c-f in FIG. 20) being configured as power terminals. Asillustrated in FIG. 12, the arrangement of the sensors 16, the leads 18,and other components of the sensor system 12 may be different betweenthe left and right foot inserts 37, and the sensors 16 may be connectedto different terminals 11 in the left insert 37 as compared to the rightinsert 37. In this embodiment, the first four terminals 11 are stillreserved for connection to the sensors 16 (albeit in potentially adifferent order), with the fifth, sixth, and seventh terminals 11retaining the same function in both the left and right inserts 37. Thisconfiguration may be different in other embodiments. In anotherembodiment, the module 22 may be specifically configured for use with aleft or right shoe 100 and insert 37. The seventh terminal may beutilized for powering of accessories, such as a unique identificationchip. In one embodiment, the sixth and seventh terminals 11 are extendedon a tail 21A that extends from the end of the extension 21. Anaccessory may be connected across the two terminals 11 on the tail 21Ato power the accessory. The accessory may include a small printedcircuit board (PCB) with a memory chip that are attached via anisotropiccontact formation to the tail 21A. In one embodiment, an accessory chipmay include information uniquely identifying the article of footwear100, such as a serial number, as well as substantive information such aswhether the footwear 100 is a left or right shoe, a men's or women'sshoe, a specific type of shoe (e.g. running, tennis, basketball, etc.),and other types of information. This information may be read by themodule 22 and subsequently used in analysis, presentation, and/ororganization of data from the sensors. The accessory may be sealed intothe housing 24, such as via epoxy or other material.

The port 14 is adapted for connection to a variety of differentelectronic modules 22, which may be as simple as a memory component(e.g., a flash drive) or which may contain more complex features. It isunderstood that the module 22 could be as complex a component as apersonal computer, mobile device, server, etc. The port 14 is configuredfor transmitting data gathered by the sensors 16 to the module 22 forstorage, transmission, and/or processing. In some embodiments, the port14, the sensors 16, and/or other components of the sensor system 12 maybe configured for processing the data. The port 14, sensors 16, and/orother components of the sensor system 12 may additionally or alternatelybe configured for transmission of data directly to an external device110 or a plurality of modules 22 and/or external devices 110. It isunderstood that the port 14, the sensors 16, and/or other components ofthe sensor system 12 may include appropriate hardware, software, etc.,for these purposes. Examples of a housing and electronic modules in afootwear article are illustrated in U.S. patent application Ser. No.11/416,458, published as U.S. Patent Application Publication No.2007/0260421, which is incorporated by reference herein and made parthereof. Although the port 14 is illustrated with electronic terminals 11forming an interface 20 for connection to a module 22, in otherembodiments, the port 14 may contain one or more additional or alternatecommunication interfaces. For example, the port 14 may contain orcomprise a USB port, a Firewire port, 16-pin port, or other type ofphysical contact-based connection, or may include a wireless orcontactless communication interface, such as an interface for Wi-Fi,Bluetooth, near-field communication, RFID, Bluetooth Low Energy, Zigbee,or other wireless communication technique, or an interface for infraredor other optical communication technique. In another embodiment, thesensor system 12 may include more than one port 14 configured forcommunication with one or more modules 22 or external devices 110. Thisconfiguration may alternately be considered to be a single distributedport 14. For example, each of the sensors 16 may have a separate port 14for communication with one or more electronic modules 22, as in theembodiment of the sensor system 812 illustrated in FIG. 61. The separateports 14 may be configured for wireless communication using wireless orcontactless communications as described above. In one embodiment, eachport 14 may include an RFID chip with an antenna, and in anotherembodiment, the port(s) 14 may utilize the user's body as a transmissionsystem, transmitting information from the user's feet to a module 22located elsewhere on the user's body. The ports 14 in this embodimentare connected to the sensors 16 by leads 18, and it is understood thatthe leads 18 in broken lines in FIG. 61 represent leads 18 on a lowerlayer of the insert 37. The ports 14 may be located between the layersof the insert 37, within a hole in the insert 37, or above or below theinsert 37 in various embodiments. It is understood that multiple ordistributed port(s) 14 may be used, with combinations of two or moresensors connected to a single port 14. In further embodiments, thesensor system 12 may include one or more ports 14 having differentconfigurations, which may include a combination of two or moreconfigurations described herein.

The module 22 may additionally have one or multiple communicationinterfaces for connecting to an external device 110 to transmit the datafor processing, as described below and shown in FIGS. 6 and 23. Suchinterfaces can include any of the contacted or contactless interfacesdescribed above. In one example, the module 22 includes at least aretractable USB connection for connection to a computer and/or forcharging a battery of the module 22. In another example, the module 22may be configured for contacted or contactless connection to a mobiledevice, such as a watch, cell phone, portable music player, etc. Themodule 22 may be configured for wireless communication with the externaldevice 110, which allows the device 22 to remain in the footwear 100.However, in another embodiment, the module 22 may be configured to beremoved from the footwear 100 to be directly connected to the externaldevice 110 for data transfer, such as by the retractable USB connectiondescribed above. In a wireless embodiment, the module 22 may beconnected to an antenna for wireless communication. The antenna may beshaped, sized, and positioned for use with the appropriate transmissionfrequency for the selected wireless communication method. Additionally,the antenna may be located internally within the module 22 or externalto the module. In one example, the sensor system 12 itself (such as theleads 18 and conductive portions of the sensors 16) could be used toform an antenna. The module 22 may further be placed, positioned, and/orconfigured in order to improve antenna reception, and in one embodiment,may use a portion of the user's body as an antenna. In one embodiment,the module 22 may be permanently mounted within the footwear 100, oralternately may be removable at the option of the user and capable ofremaining in the footwear 100 if desired. Additionally, as furtherexplained below, the module 22 may be removed and replaced with anothermodule 22 programmed and/or configured for gathering and/or utilizingdata from the sensors 16 in another manner. If the module 22 ispermanently mounted within the footwear 100, the sensor system 12 mayfurther contain an external port (not shown) to allow for data transferand/or battery charging, such as a USB or Firewire port. It isunderstood that the module 22 may be configured for both contacted andcontactless communication.

While the port 14 may be located in a variety of positions withoutdeparting from the invention, in one embodiment, the port 14 is providedat a position and orientation and/or is otherwise structured so as toavoid or minimize contact with and/or irritation of the wearer's foot,e.g., as the wearer steps down in and/or otherwise uses the article offootwear 100, such as during an athletic activity. The positioning ofthe port 14 in FIGS. 3-4 illustrates one such example. In anotherembodiment, the port 14 is located proximate the heel or instep regionsof the shoe 100. Other features of the footwear structure 100 may helpreduce or avoid contact between the wearer's foot and the port 14 (or anelement connected to the port 14) and improve the overall comfort of thefootwear structure 100. For example, as described above and illustratedin FIGS. 3-5, the foot contacting member 133 may fit over and at leastpartially cover the port 14, thereby providing a layer of paddingbetween the wearer's foot and the port 14. Additional features forreducing contact between and modulating any undesired feel of the port14 at the wearer's foot may be used. If desired, the opening to the port14 may be provided through the top surface of the foot contacting member133 without departing from the invention. Such a construction may beused, for example, when the housing 24, electronic module 22, and otherfeatures of the port 14 include structures and/or are made frommaterials so as to modulate the feel at the user's foot, when additionalcomfort and feel modulating elements are provided, etc. Any of thevarious features described above that help reduce or avoid contactbetween the wearer's foot and a housing (or an element received in thehousing) and improve the overall comfort of the footwear structure maybe provided without departing from this invention, including the variousfeatures described above in conjunction with the attached figures, aswell as other known methods and techniques.

FIGS. 62-76 disclose further views of one embodiment of the port 14configured to be utilized with the insert member 37. Similar structuresdescribed above will be designated with identical or similar referencenumerals. This embodiment and variations of the embodiment are describedin detail below. As discussed and disclosed herein, the port 14 definesor supports an interface 20 for an operable connection with the module22. The module 22 will also be described in greater detail below.Through the operable connection between the port 14 and the module 22,data sensed by the sensor assembly 12 can be acquired, stored and/orprocessed for further use and analysis.

As appreciated from FIGS. 62-64, the port 14 is generally supported at amid-portion of the insert assembly 37. The port 14 generally includesthe housing 24 that supports an interface assembly 156. As will bedescribed in greater detail below, the interface assembly 156 isoperably connected to the extension 21 having the leads 11 thereon ofthe insert member 37. With such connection, the interface 20 isestablished for further operable connection with the interface 23 of themodule 22.

As further shown in FIGS. 65-67, the housing 24 in this embodimentincludes a base member 140 and a cover member 142. The base member 140may correspond to the tub 29 as described above that defines the sidewalls 25 and the base wall 26. A first end of the base member 140 has agenerally squared configuration that receives the extension 21 of theinsert member 37. A second end of the base member 140 has a roundedconfiguration. The base member 140 defines a first section 144 and asecond section 146. The first section 144 is generally dimensioned tocorrespond in shape and receive the module 22, and the second section146 is dimensioned to receive and support the interface assembly 156.The second section 146 further has a first lateral slot 148 and a secondlateral slot 150 that are in communication with one another. The firstlateral slot 148 may extend wider and be larger than the second lateralslot 150. The housing 24 further defines a projection 151 at the secondend for retaining the module 22 in the housing 24. The finger recess 29Ais generally positioned proximate the projection 151. The base member140 further has a pair of receivers 152 for cooperation with the covermember 142.

As further shown in FIGS. 66-67, the cover member 142 has a centralaperture 153 dimensioned to receive the module 22 therethrough. Thecover member 142 further has a beam member 154 at a first end and asecond end of the cover member 142 has a rounded configuration. The beammember 154 overhangs above a portion of the first section 144 whenconnected to the base member 140 as will be described. An underside ofthe cover member 142 has a pair of depending posts 155 that cooperatewith the receivers 152 on the base member 140 as will be described. Anouter periphery of the cover member 142 defines the lip or flange 28. Inan exemplary embodiment, the cover member 142 may have depending wallsthat cooperatively define the side walls 25 of the housing 24. In suchconfiguration, the base member 140 may define a ledge on the side wallto receive the depending walls on the cover member 142.

FIGS. 68-71 further show components of the interface assembly 156. Theinterface assembly 156 has a carrier 157 that supports the electricalconnectors 82 such as described schematically in reference to FIG. 32.The electrical connectors 82 each have a distal end defining a contactthat is resiliently supported by the carrier 157 that will cooperatewith a corresponding contact on the module 22. The electrical connectors82 have bends around the carrier 157 and have proximate ends having aplurality of fingers 158 thereon. In one embodiment, four fingers 158are associated with each connector 82, and the fingers 158 may bearranged in a flower-petal arrangement. As explained in greater detailbelow, the interface assembly 156 may further include a filler material159 or potting compound 159. It is also understood that ends 82A of theconnectors are snapped off at a predetermined location prior toconnection with the extension 21 of the insert member 37, as shown inFIG. 69.

As shown in FIGS. 72-73, the interface assembly 156 is operablyconnected to the extension 21 having the leads 11 thereon of the insertmember 37. To that end, the fingers 158 are connected to the extension21 where there is engagement between the leads 11 and the connectors 82.This engagement can be seen and appreciated from FIG. 72 and alsounderstood from FIG. 32. In an exemplary embodiment, the fingers 158protrude through the extension 21, wherein each plurality of fingers 158extend through and engage the extension 21 in a circumferential manner.As further shown in FIGS. 72, it is understood that the tail 21A can befurther folded over to be positioned adjacent a back side of theextension 21. As discussed, the tail 21A having the sixth and seventhconnectors may have a PCB member 90, which may be an uniqueidentification chip, connected thereto to function as previouslydescribed. It is understood that the extension 21 and carrier 157 arepositioned to depend from an upper planar surface of the insert member37. As further shown in FIG. 74, the carrier 157 is positioned in thefirst lateral slot 148 of the base member 140 of the housing 24. Thecarrier 157 is dimensioned to fit snugly and be retained in the firstlateral slot 148. The connectors 82 face into the first section 144defined by the housing 24. As can be appreciated from FIGS. 75-76, it isunderstood that the filler material 159 or potting compound 159 may beinjected into the second lateral slot 150 through an opening 150A (FIG.65) in the base member 140 proximate the second lateral slot 150. Thepotting compound 159 may be a thermosetting plastic in an exemplaryembodiment and could also be one or more other materials. The pottingcompound 159 fills the second lateral slot 150 and extends around thearea wherein the extension 21 is connected to the connectors 82 held bythe carrier 157, thus providing a protective connection. In oneembodiment, the potting compound 159 maintains a desired amount offlexibility to enhance the connection between the extension 21 and theport 14. The potting compound 159 can resist shock and vibration whilealso resisting moisture ingress and corrosive agents. It is furtherunderstood that the base member 140 is positioned at the insert member37 wherein the receivers 152 align with corresponding openings 28Bthrough the insert member 37. The cover member 142 is positioned on thetop surface of the insert member 37 wherein the depending posts 155 fitinto the receivers 152 (FIGS. 62-67). An ultrasonic welding operation isperformed to connect the cover member 142 to the base member 140. Thisconnection is similar to the connection of the pegs 28A as shown in FIG.31. Other connection techniques for connecting the cover member 142 tothe base member 140 may be utilized in other embodiments, includingsnapping connections or other mechanical connections. It is understoodthat the beam member 154 extends over the interface 20 wherein theconnectors 82 are protected in the housing 24. This configurationprovides a robust connection of the port 14 to the insert member 37 andfor further operable connection with the module 22 as described herein.

FIGS. 77-90 disclose additional views and features of one embodiment ofthe module 22, which is described in greater detail below. As previouslydiscussed, the module 22 is received by and is operably connected to theport 14 to collect, store and/or process data received from the sensorassembly 12. It is understood that the module 22 houses variouscomponents for such purposes including but not limited to, printedcircuit boards, power supplies, light members, interfaces, and differenttypes of sensors, including multi-axis accelerometer, gyroscopes and/ormagnetometers.

The module 22 generally includes a housing 170 that supports aninterface 23 having electrical connectors that form contacts forcooperation with the interface 20 of the port 14. As explained ingreater detail below, the contacts associated with the interface 23 ofthe module 22 are formed such that they are in a sealed configuration toprotect against moisture ingress. The module 22 further has adead-fronted LED light indicator that is only visually perceptible uponillumination. Finally, the module 22 utilizes a unique ground planeextender that enhances operation of the module 22.

As shown in FIGS. 79-83, the housing 170 of the module 22 supports aninterface assembly 171. The interface assembly 171 has a plurality ofconnectors 172 and a module carrier 173. The connectors 172 each havedistal ends that form contacts that collectively define the interface 23of the module 22. It is understood that the connectors 172 are insertmolded such that material is formed around the connectors 172 to definethe module carrier 173. It is also understood that portions 172A (FIG.79) of the connectors 172 are snapped off at a predetermined location toplace the connectors 172 at a proper length for further operableconnection. The housing 170 generally has a module base member 174having an outer base member 175 and an inner base member 176. Thehousing 170 further has a module top member 177 having an outer topmember 178 and an inner top member 179. The module base members 175,176, the module top members 178, 179 and interface assembly 171cooperate to provide a sealed configuration around the connectors 172.The connectors 172 may be considered to have an over-moldedconfiguration. These components also form an inner cavity wherein thehousing 170 supports internal components including a printed circuitboard 180 that is operably connected to the connectors 172.

As discussed, the connectors 172 are insert molded wherein the modulecarrier 173 is formed around the connectors 172. It is understood thatthe outer base member 175 is formed such as in an injection-moldingprocess and defines an end opening. In such process, the connectors 172can be sufficiently supported in the mold to withstand the pressuresassociated with the injection-molding process. The interface assembly171 and outer base member 175 are placed in a mold wherein the interfaceassembly 171 is positioned at the end opening and supported by the outerbase member 175. In a further injection-molding process, additionalmaterial is injected into the mold to form inner base member 176. Theinner base member 176 is formed around the module carrier 173 and distalends of the connectors 172 and further against surfaces of the outerbase member 175. An internal cavity is defined by the inner base member176 wherein the printed circuit board 180 is supported therein as isknown. It is understood that the connectors 172 are operably connectedto the printed circuit board 180. It is further understood that othercomponents of the module 22 are supported in the internal cavity. Asexplained in greater detail below, the connectors 172 are configured ina sealed fashion from the over-molding process.

The module top member 177 as shown in FIGS. 85-86 and 89-90, includingan inner top member 179 and an outer top member 178, may also be formedusing an injection technique in one embodiment. As shown in FIG. 88, theinner top member 179 has an aperture 181 therethrough. The outer topmember 178 is generally a planar member. The inner top member 179 ispositioned over the base member 174 and the outer top member 178 ispositioned over the inner top member 179. The top member 177 isconnected to the base member 175 to encase the internal components ofthe module 22.

With this structural configuration, the connectors 172 are sealed toprevent potential moisture ingress. As shown in FIG. 84, the carrier 173is in surface-to-surface engagement with the connectors 172 generally atinner surfaces of the connectors 172. In addition, the inner base member176 is positioned around the connectors 172 generally at outer surfacesof the connectors 172. The inner base member 176 further has anengagement surface 182 that abuts and engages an engagement surface 183defined by the outer base member 175. As further shown in FIG. 84, withsuch configuration, a tortuous path represented by the phantom line L,is defined. Such tortuous path L minimizes the chances for moistureingress. For example, a user may run through water puddles during usepotentially exposing the port 14 and module 22 to moisture. In anexemplary embodiment, the connectors 172 are considered to be sealed to5 ATM. A bonding material (e.g. adhesive) may be utilized between themodule carrier 173 and the inner base member 176 proximate the tortuouspath L, such as at one or both points P in FIG. 84.

It is understood that the module 22 is received in the port 14. A frontend of the module 22 is inserted through the central aperture 153 andinto the first section 144. The module 22 is dimensioned to generallycorrespond in size to the first section 144 and in an interference fit.In such configuration, the interface 23 on the module 22 is operablyengaged with the interface 20 on the port 14 wherein the respectivecontacts of the interfaces 20, 23 are in surface-to-surface contact.Thus, the construction is such that the interface 23 of the module 22 isforced against the interface 20 of the port 14. The module 22 may have arecess 184 on a rear surface that receives the projection 151 of thehousing 24 to assist in retaining the module 22 in the port 14 through asnap connection. A user can easily remove the module 22 from the port byaccessing the module 22 with the assistance of the finger recess 29A.Thus, the modules 22 can easily be inserted into the port 14 and removedfrom the port 14 when necessary such as for charging or transferringdata, or when replacing one type of module 22 for one application with adifferent type of module for a different application, or replacing apower drained module 22 with a freshly charged module 22.

As shown in FIGS. 85-90, the module 22 is provided with a light assembly185 to provide lighted indicia to a user. The light assembly 185 isoperably connected to the printed circuit board 180. The light assembly185 generally includes a light member 186 and a light guide 187. Thelight member 186 is an LED light member in an exemplary embodimentalthough other light members can be used. The light member 186 has anarcuate section 188 and is configured to project light in a firstdirection such as shown by the arrow A1, which may be a horizontaldirection in an exemplary embodiment. The light member 186 may beconsidered to be a side-firing LED. The light guide 187 has a firstsection 189 defining a first passageway 190 configured in a firstdirection. The first section 189 has a recessed area that generallycorresponds to and receives the arcuate section 188 of the light member186 to capture as much light from the light member 186 as possible.Thus, the first section 189 is in confronting relation to the arcuatesection 188 of the light member 186 and partially encircles the lightmember 186. As shown in the figures, the light guide 187 has a geometrythat assists in spreading the light to a larger area, thus spreading thelight out along an arc. The light guide 187 further has a second section191 defining a second passageway 192 configured in a second direction.The second passageway 192 extends upwards and at an angle and is thusdifferent from the first direction. In one exemplary embodiment, thesecond section 191 is inclined at approximately a 45 degree angle whichwas determined to enhance reflection of the light. The second passageway192 has a distal end that is positioned proximate the aperture 181 inthe inner top member 179. The light guide 187 may be treated with adispersant agent such as by adding the agent to the resin prior toinjection molding the light guide. Because the light member 186 andlight guide 187 are configured in confronting relation, the componentsachieve a minimized footprint, which is helpful due to the limited areadefined in the module 22. In operation, the light member 186 isactivated as desired via the printed circuit board 180. Light isprojected in the direction shown by the arrow A1. Light is alsoprojected in an arcuate configuration based on the shape of the lightguide 187. The light is projected in these directions into the firstpassageway 190. The light guide 187 directs the light into the secondpassageway 192 in the direction of arrow A2 upwards. As the light isinitially projected from the side firing LED, the light transitions fromthe direction A1 to an inclined direction towards the second passageway192. Light then passes through the aperture 181 in the direction A2 andshines through outer top member 178. The geometry of the light guide 187is tailored to evenly disperse light in a very short path-length asshown. The dispersant agent used with the light guide 187 assists indiffusing light more evenly, thus minimizing concentrations of lightfrom the light member 186. Because of the short path-length involved,the LED light member 186 could project light that had more focusedbrightness in certain areas. With the present design, light is moreevenly spread and reflected where there is a limited gradient of lightacross the aperture 181. The outer top member 178 positioned over theaperture 181 is structured in thickness and colorant loading of thematerial to provide a desired translucency. Thus, as can be appreciatedfrom FIGS. 90 and 91, when the light member 186 is not illuminated, auser cannot detect that an LED exists in the module 22, thus providing ablank or “dead-front” appearance. Once the light member 186 isactivated, light is directed along the arrow A1 and upwards along thearrow A2, and through the aperture 181 and outer top member 178 as shownby the designation LT in FIG. 91. With the geometry and treatment of thelight guide 187 and top members, light is reflected in a more enhancedmanner providing an evenly dispersed light across the entire area of thelight shining through the top member. Additional structures could alsobe added to reflect the light in a more enhanced manner. For example,the light guide 187 could be provided with a surface texture to enhancelight reflection. The inclined wall of the light guide 187 or othersurfaces could be painted or have a sticker applied thereon to achievedesired changes in light reflection. It is understood that the lightmember 186 may project light in multiple colors. The light member 186provides indicia for indicating various parameters including batterylife of the module 22.

The constructions of the port 14 and module 22 described herein providea snug fit. The constructions provide a water tight configuration andresist moisture ingress. These properties are achieved while maintainingan operable connection between the port 14 and module 22. The fingers158 on the interface assembly also provide a robust connection with theextension 21 of the insert member 37 as engagement locations between thefingers and extension are maximized. The filler material 159 is selectedto have a desired hardness to provide sufficient flexibility andanti-corrosion properties. In one exemplary embodiment, the fillermaterial 159 may have a shore durometer on the type A scale of 30 orlower. The filler material 159 provides protection around the connectionbetween the extension 21 and the interface assembly 156. Thereceiver/post connections of the housing and insert member 37 furtherprovides stress relief to the insert member 37 to minimize chances thatthe insert member 37 could tear during use.

FIGS. 91-94 disclose additional features relating to a ground planextender associated with the module 22. In particular, further aspectsrelate to maximizing the surface area of a layer of a PCB of one or moreelectronic devices, such as the module 22. Certain aspects relate toincreasing the surface area of a ground plane layer of a PCB. FIG. 91shows a perspective top view of example PCB 1002, which may comprise onor more components in electric communication, including but not limitedto processors, capacitors, diodes, resistors, and/or combinationsthereof. PCB 1002 is shown to be planar across a horizontal axis (“x”axis), however, those skilled in the art will appreciate that PCB 1002(or a plurality of individual PCBs in operative communication) may beconfigured to form a non-planar structure. PCB 1002 further comprises aground plane layer (see 1004) formed of conductive material, such as forexample, copper. As shown in FIG. 91, the visible portion of groundplane layer 1004 is positioned around a periphery of PCB 1002, however,portions of layer 1004 may be disposed and/or connected to otherportions of PCB 1002.

In certain embodiments, at least one component of PCB 1002 may beconfigurable to be in operatively communication with a portable powersupply, such as for example, a battery (not shown in FIGS. 91-93 butshown in FIG. 94). PCB 1002 may be configured for placement within aportable device having limited dimensions for batteries or other formsof portable power supplies. Due to the aforementioned dimensionalrestrictions of portable devices, batteries are often small, and suchmay have limited service time between charges and/or limited rates ofdischarge. In accordance with one embodiment, PCB 1002 may comprise aspace, such as battery space 1006. As shown in FIG. 91, battery space1006 comprises area along the x and z plane of PCB 1002 to permitplacement of a power source adjacent to PCB 1002. PCB 1002 may bemanufactured to dimensions creating battery space 1002 or may beconfigured to be altered (such as through snap regions and/or areas ofalternating thickness) to form one or more battery spaces. In thisregard, although the illustrative space is a battery space, thoseskilled in the art will appreciate that this disclosure is not limitedto only those areas and/or spaces configured for housing or positioninga battery.

Although battery space 1006 of PCB 1002 is shown as a slot configurationflanked on three sides by portions of PCB 1002, those skilled in the artwill readily appreciate that the shape, size and/or configuration of PCB1002 is merely illustrative and other shapes are within the scope ofthis disclosure. The exact shape and size of battery space 1006 may bedictated by its intended use and is not limited by this disclosure. Theonly requirement, therefore, of battery space 1006 is the inclusion ofarea along the horizontal plane (e.g., along the x-axis) of PCB 1002 topermit placement of a power source along the same plane and adjacent toPCB 1002. As shown in FIG. 94, which shows a side view of PCB 1002, abattery, such as battery 1008, may be positioned along the horizontalplane (x-axis) of the PCB 1002. Because battery 1008 occupies areawithin battery space 1006, the surface area of the PCB 1002 is minimizedas compared with a PCB not having a space, such as battery space 1008,but instead includes a greater area of the ground plane layer 1004located in the same spot.

In accordance with certain embodiments, a ground plane extender (see,e.g., 1010) may be electronically connected to the ground plane layer1004 of the PCB 1002. FIG. 92 shows an example ground plane extender1010 in accordance with one embodiment. Ground plane extender 1010 maybe formed of any material that effectively increases the surface area ofthe ground plane layer 1004. In one embodiment, the ground planeextender may comprise copper and/or aluminum, however, in furtherembodiments any conductive material may be utilized for at least aportion of ground plane extender 1010. One or more connectors 1012 maybe utilized to allow contact (and/or alignment) between extender 1010and ground plane layer 1004, either by conductive adhesives, soldering,pass through soldering, welding, snapping in, and combinations thereof.As best shown in FIG. 92, extender 1010 may be placed adjacent to oneside of the battery 1008 (e.g., the top), and comprise a portion such asa top region (e.g., 1014) that is substantially parallel to, and thusplanar with, PCB 1002 along the horizontal (x) axis. For example,extender 1010 may comprise a vertical ridge 1016 that operativelyconnects to and extends from PCB 1002 to top region 1016. Top region1016 may comprise one or more apertures 1018 that may permit heatexchange from the surrounding components, including battery 1008.

As seen in FIG. 94, extender 1010 is shown adjacent to a first side(e.g., top side) of battery 1008 and electronically connected with PCB1002 and an antenna 1020 is positioned adjacent to an opposing side(e.g. the bottom) of battery 1008. In the example embodiment of FIG. 94,the ground plane extender 1010 and antenna 1020 are also in parallelconfiguration with PCB 1002 and each other. Thus, in at least oneembodiment, a portable device may comprise three layers—a first layercomprising a ground plane extender, such as extender 1010, a secondlayer comprising a battery positioned such that at least a portion ofthe battery is along the same plane as a PCB operatively connected tothe ground plane extender, and a third layer comprising an antenna, suchas antenna, such as antenna 1020. In the illustrative embodiment, thelayers are vertically arranged; however, other arrangements are withinthe scope of this disclosure. In this regard, there is no requirementthat each layer be in direct physical contact with the adjacent surfaceof an adjacent layer, unless otherwise stated. For example, there is norequirement that antenna 1020 be in direct physical contact with theadjacent surface of battery 1008.

FIG. 6 shows a schematic diagram of an example electronic module 22including data transmission/reception capabilities through a datatransmission/reception system 107, which may be used in accordance withat least some examples of this invention. While the example structuresof FIG. 6 illustrate the data transmission/reception system (TX-RX) 107as integrated into the electronic module structure 22, those skilled inthe art will appreciate that a separate component may be included aspart of a footwear structure 100 or other structure for datatransmission/reception purposes and/or that the datatransmission/reception system 107 need not be entirely contained in asingle housing or a single package in all examples of the invention.Rather, if desired, various components or elements of the datatransmission/reception system 107 may be separate from one another, indifferent housings, on different boards, and/or separately engaged withthe article of footwear 100 or other device in a variety of differentmanners without departing from this invention. Various examples ofdifferent potential mounting structures are described in more detailbelow.

In the example of FIG. 6, the electronic component 22 may include a datatransmission/reception element 107 for transmitting data to and/orreceiving data from one or more remote systems. In one embodiment, thetransmission/reception element 107 is configured for communicationthrough the port 14, such as by the contacted or contactless interfacesdescribed above. In the embodiment shown in FIG. 6, the module 22includes an interface 23 configured for connection to the port 14 and/orsensors 16. In the module 22 illustrated in FIG. 6, the interface 23 hascontacts that are complementary with the terminals 11 of the interface20 of the port 14, to connect with the port 14. In other embodiments, asdescribed above, the port 14 and the module 22 may contain differenttypes of interfaces 20, 23, which may be contacted or wireless. It isunderstood that in some embodiments, the module 22 may interface withthe port 14 and/or sensors 16 through the TX-RX element 107.Accordingly, in one embodiment, the module 22 may be external to thefootwear 100, and the port 14 may comprise a wireless transmitterinterface for communication with the module 22. The electronic component22 of this example further includes a processing system 202 (e.g., oneor more microprocessors), a memory system 204, and a power supply 206(e.g., a battery or other power source). In one embodiment, the powersupply 206 may be configured for inductive charging, such as byincluding a coil or other inductive member. In this configuration, themodule 22 may be charged by placing the article of footwear 100 on aninductive pad or other inductive charger, allowing charging withoutremoval of the module 22 from the port 14. In another embodiment, thepower supply 206 may additionally or alternately be configured forcharging using energy-harvesting technology, and may include a devicefor energy harvesting, such as a charger that charges the power supply206 through absorption of kinetic energy due to movement of the user.

Connection to the one or more sensors can be accomplished as shown inFIG. 6, but additional sensors (not shown) may be provided to sense orprovide data or information relating to a wide variety of differenttypes of parameters, such as physical or physiological data associatedwith use of the article of footwear 100 or the user, including pedometertype speed and/or distance information, other speed and/or distance datasensor information, temperature, altitude, barometric pressure,humidity, GPS data, accelerometer output or data, heart rate, pulserate, blood pressure, body temperature, EKG data, EEG data, dataregarding angular orientation and changes in angular orientation (suchas a gyroscope-based sensor), etc., and this data may be stored inmemory 204 and/or made available, for example, for transmission by thetransmission/reception system 107 to some remote location or system. Theadditional sensor(s), if present, may also include an accelerometer(e.g., for sensing direction changes during steps, such as for pedometertype speed and/or distance information, for sensing jump height, etc.).In one embodiment, the module 22 may include an additional sensor 208,such as an accelerometer, and the data from the sensors 16 may beintegrated with the data from the accelerometer 208, such as by themodule 22 or the external device 110.

As additional examples, electronic modules, systems, and methods of thevarious types described above may be used for providing automatic impactattenuation control for articles of footwear. Such systems and methodsmay operate, for example, like those described in U.S. Pat. No.6,430,843, U.S. Patent Application Publication No. 2003/0009913, andU.S. Patent Application Publication No. 2004/0177531, which describesystems and methods for actively and/or dynamically controlling theimpact attenuation characteristics of articles of footwear (U.S. Pat.No. 6,430,843, U.S. Patent Application Publication No. 2003/0009913, andU.S. patent application Publication No. 2004/0177531 are each entirelyincorporated herein by reference and made part hereof). When used forproviding speed and/or distance type information, sensing units,algorithms, and/or systems of the types described in U.S. Pat. Nos.5,724,265, 5,955,667, 6,018,705, 6,052,654, 6,876,947 and 6,882,955 maybe used. These patents each are entirely incorporated herein byreference. Additional embodiments of sensors and sensor systems, as wellas articles of footwear and sole structures and members utilizing thesame, are described in U.S. Patent Application Publications Nos.2010/0063778 and 2010/0063779, which applications are incorporated byreference herein in their entireties and made part hereof

The electronic module 22 can also include an activation system (notshown). The activation system or portions thereof may be engaged withthe module 22 or with the article of footwear 100 (or other device)together with or separate from other portions of the electronic module22. The activation system may be used for selectively activating theelectronic module 22 and/or at least some functions of the electronicmodule 22 (e.g., data transmission/reception functions, etc.). A widevariety of different activation systems may be used without departingfrom this invention, and a variety of such systems will be described inmore detail below with respect to various included figures. In oneexample, the sensor system 12 may be activated and/or deactivated byactivating the sensors 16 in a specific pattern, such as consecutive oralternating toe/heel taps. In another example, the sensor system 12 maybe activated by a button or switch, which may be located on the module22, on the shoe 100, or on an external device in communication with thesensor system 12, as well as other locations. In any of theseembodiments, the sensor system 12 may contain a “sleep” mode, which candeactivate the system 12 after a set period of inactivity. In analternate embodiment, the sensor system 12 may operate as a low-powerdevice that does not activate or deactivate.

The module 22 may further be configured for communication with anexternal device 110, which may be an external computer or computersystem, mobile device, gaming system, or other type of electronicdevice, as shown in FIG. 23. The exemplary external device 110 shown inFIG. 23 includes a processor 302, a memory 304, a power supply 306, adisplay 308, a user input 310, and a data transmission/reception system108. The transmission/reception system 108 is configured forcommunication with the module 22 via the transmission/reception system107 of the module 22, through any type of known electroniccommunication, including the contacted and contactless communicationmethods described above and elsewhere herein. It is understood that themodule 22 and/or the port 14 can be configured for communication with aplurality of external devices, including a wide variety of differenttypes and configurations of electronic devices, and also includingintermediate devices that function to pass information on to anotherexternal device and may or may not further process such data.Additionally, the transmission/reception system 107 of the module 22 maybe configured for a plurality of different types of electroniccommunication. It is further understood that the shoe 100 may include aseparate power source to operate the sensors 16 if necessary, such as abattery, piezoelectric, solar power supplies, or others. In theembodiment of FIGS. 3-22B, the sensors 16 receive power throughconnection to the module 22.

As described below, such sensor assemblies can be customized for usewith specific software for the electronic module 22 and/or the externaldevice 110. A third party may provide such software along with a soleinsert having a customized sensor assembly, as a package. The module 22and/or the overall sensor system 12 may cooperate with one or morealgorithms for analysis of the data obtained from the sensors 16,including algorithms stored on and/or executed by the module, theexternal device 110, or another component.

In operation, the sensors 16 gather data according to their function anddesign, and transmit the data to the port 14. The port 14 then allowsthe electronic module 22 to interface with the sensors 16 and collectthe data for later use and/or processing. In one embodiment, the data iscollected, stored, and transmitted in a universally readable format, sothe data is able to be accessed and/or downloaded by a plurality ofusers, with a variety of different applications, for use in a variety ofdifferent purposes. In one example, the data is collected, stored, andtransmitted in XML format. In one embodiment, the module 22 detectspressure changes in the sensors 16 utilizing the circuit 10 as shown inFIG. 20, by measuring the voltage drop at the measurement terminal 104b, which is reflective of the changes in resistance of the particularsensor 16 that is currently switched. FIG. 27 illustrates one example ofa pressure—resistance curve for a sensor 16, with broken linesillustrating potential shifts of the curve due to factors such asbending of the insert 37. The module 22 may have an activationresistance R_(A), which is the detected resistance necessary for themodule 22 to register the pressure on the sensor. The correspondingpressure to produce such resistance is known as the activation pressureP_(A). The activation resistance R_(A) may be selected to correspond toa specific activation pressure P_(A) at which it is desired for themodule 22 to register data. In one embodiment, the activation pressureP_(A) may be about 0.15 bar, about 0.2 bar, or about 0.25 bar, and thecorresponding activation resistance R_(A) may be about 100 kΩ.Additionally, in one embodiment, the highest sensitivity range may befrom 150-1500 mbar. In one embodiment, the sensor system 12 constructedas shown in FIGS. 3-22B can detect pressures in the range of 0.1-7.0 bar(or about 0.1-7.0 atm), and in another embodiment, the sensor system 12may detect pressures over this range with high sensitivity.

In different embodiments, the sensor system 12 may be configured tocollect different types of data. In one embodiment (described above),the sensor(s) 16 can collect data regarding the number, sequence, and/orfrequency of compressions. For example, the system 12 can record thenumber or frequency of steps, jumps, cuts, kicks, or other compressiveforces incurred while wearing the footwear 100, as well as otherparameters, such as contact time and flight time. Both quantitativesensors and binary on/off type sensors can gather this data. In anotherexample, the system can record the sequence of compressive forcesincurred by the footwear, which can be used for purposes such asdetermining foot pronation or supination, weight transfer, foot strikepatterns, or other such applications. In another embodiment (alsodescribed above), the sensor(s) 16 are able to quantitatively measurethe compressive forces on the adjacent portions of the shoe 100, and thedata consequently can include quantitative compressive force and/orimpact measurement. Relative differences in the forces on differentportions of the shoe 100 can be utilized in determining weightdistribution and “center of pressure” of the shoe 100. The weightdistribution and/or center of pressure can be calculated independentlyfor one or both shoes 100, or can be calculated over both shoestogether, such as to find a center of pressure or center of weightdistribution for a person's entire body. In further embodiments, thesensor(s) 16 may be able to measure rates of changes in compressiveforce, contact time, flight time or time between impacts (such as forjumping or running), and/or other temporally-dependent parameters. It isunderstood that, in any embodiment, the sensors 16 may require a certainthreshold force or impact before registering the force/impact, asdescribed above.

As described above, the data is provided through the universal port 14to the module 22 in a universally readable format, so that the number ofapplications, users, and programs that can use the data is nearlyunlimited. Thus, the port 14 and module 22 are configured and/orprogrammed as desired by a user, and the port 14 and module 22 receiveinput data from the sensor system 12, which data can be used in anymanner desired for different applications. The module 22 may be able torecognize whether the data received is related to a left or right shoe,such as through the use of the unique identification chip 92 asdescribed herein. The module 22 may process the data differentlyaccording to the recognition of L/R shoe, and may also transmit the datato the external device 110 with an identification of whether the data isfrom a L/R shoe. The external device 110 may likewise process orotherwise handle the data differently based on the identification of L/Rshoe as well. In one example, the connections of the sensors 16 to theterminals 11 and the interface 20 may be different between the left andright inserts 37, as shown in FIG. 12 and discussed above. The data fromthe left insert 37 may be interpreted differently from the data from theright insert 37 in accordance with this arrangement. The module 22and/or the electronic device 110 may perform similar actions withrespect to other identifying information contained on the uniqueidentification chip 92. In many applications, the data is furtherprocessed by the module 22 and/or the external device 110 prior to use.In configurations where the external device 110 further processes thedata, the module 22 may transmit the data to the external device 110.This transmitted data may be transmitted in the sameuniversally-readable format, or may be transmitted in another format,and the module 22 may be configured to change the format of the data.Additionally, the module 22 can be configured and/or programmed togather, utilize, and/or process data from the sensors 16 for one or morespecific applications. In one embodiment, the module 22 is configuredfor gathering, utilizing, and/or processing data for use in a pluralityof applications. Examples of such uses and applications are given below.As used herein, the term “application” refers generally to a particularuse, and does not necessarily refer to use in a computer programapplication, as that term is used in the computer arts. Nevertheless, aparticular application may be embodied wholly or partially in a computerprogram application.

Further, in one embodiment, the module 22 can be removed from thefootwear 100 and replaced with a second module 22 configured foroperating differently than the first module 22. For example, thereplacement is accomplished by lifting the foot contacting member 133,disconnecting the first module 22 from the port 14 and removing thefirst module 22 from the housing 24, then inserting the second module 22into the housing 24 and connecting the second module 22 to the port 14,and finally placing the foot contacting member 133 back into position.The second module 22 may be programmed and/or configured differentlythan the first module 22. In one embodiment, the first module 22 may beconfigured for use in one or more specific applications, and the secondmodule 22 may be configured for use in one or more differentapplications. For example, the first module 22 may be configured for usein one or more gaming applications and the second module 22 may beconfigured for use in one or more athletic performance monitoringapplications. Additionally, the modules 22 may be configured for use indifferent applications of the same type. For example, the first module22 may be configured for use in one game or athletic performancemonitoring application, and the second module 22 may be configured foruse in a different game or athletic performance monitoring application.As another example, the modules 22 may be configured for different useswithin the same game or performance monitoring application. In anotherembodiment, the first module 22 may be configured to gather one type ofdata, and the second module 22 may be configured to gather a differenttype of data. Examples of such types of data are described herein,including quantitative force and/or pressure measurement, relative forceand/or pressure measurement (i.e. sensors 16 relative to each other),weight shifting/transfer, impact sequences (such as for foot strikepatterns) rate of force and/or pressure change, etc. In a furtherembodiment, the first module 22 may be configured to utilize or processdata from the sensors 16 in a different manner than the second module22. For example, the modules 22 may be configured to only gather, store,and/or communicate data, or the modules 22 may be configured to furtherprocess the data in some manner, such as organizing the data, changingthe form of the data, performing calculations using the data, etc. Inyet another embodiment, the modules 22 may be configured to communicatedifferently, such as having different communication interfaces or beingconfigured to communicate with different external devices 110. Themodules 22 may function differently in other aspects as well, includingboth structural and functional aspects, such as using different powersources or including additional or different hardware components, suchas additional sensors as described above (e.g. GPS, accelerometer,etc.).

One use contemplated for the data collected by the system 12 is inmeasuring weight transfer, which is important for many athleticactivities, such as a golf swing, a baseball/softball swing, a hockeyswing (ice hockey or field hockey), a tennis swing, throwing/pitching aball, etc. The pressure data collected by the system 12 can givevaluable feedback regarding balance and stability for use in improvingtechnique in any applicable athletic field. It is understood that moreor less expensive and complex sensor systems 12 may be designed, basedon the intended use of the data collected thereby.

The data collected by the system 12 can be used in measurement of avariety of other athletic performance characteristics. The data can beused to measure the degree and/or speed of foot pronation/supination,foot strike patterns, balance, and other such parameters, which can beused to improve technique in running/jogging or other athleticactivities. With regard to pronation/supination, analysis of the datacan also be used as a predictor of pronation/supination. Speed anddistance monitoring can be performed, which may include pedometer-basedmeasurements, such as contact measurement or loft time measurement. Jumpheight can also be measured, such as by using contact or loft timemeasurement. Lateral cutting force can be measured, includingdifferential forces applied to different parts of the shoe 100 duringcutting. The sensors 16 can also be positioned to measure shearingforces, such as a foot slipping laterally within the shoe 100. As oneexample, additional sensors may be incorporated into the sides of theupper 120 of the shoe 100 to sense forces against the sides.

The data, or the measurements derived therefrom, may be useful forathletic training purposes, including improving speed, power, quickness,consistency, technique, etc. The port 14, module 22, and/or externaldevice 110 can be configured to give the user active, real-timefeedback. In one example, the port 14 and/or module 22 can be placed incommunication with a computer, mobile device, etc., in order to conveyresults in real time. In another example, one or more vibration elementsmay be included in the shoe 100, which can give a user feedback byvibrating a portion of the shoe to help control motion, such as thefeatures disclosed in U.S. Pat. No. 6,978,684, which is incorporatedherein by reference and made part hereof. Additionally, the data can beused to compare athletic movements, such as comparing a movement with auser's past movements to show consistency, improvement, or the lackthereof, or comparing a user's movement with the same movement ofanother, such as a professional golfer's swing. Further, the system 12may be used to record biomechanical data for a “signature” athleticmovement of an athlete. This data could be provided to others for use induplicating or simulating the movement, such as for use in gamingapplications or in a shadow application that overlays a movement over auser's similar movement.

The system 12 can also be configured for “all day activity” tracking, torecord the various activities a user engages in over the course of aday. The system 12 may include a special algorithm for this purpose,such as in the module 22, the external device 110, and/or the sensors16.

The system 12 may also be used for control applications, rather thandata collection and processing applications. In other words, the system12 could be incorporated into footwear, or another article thatencounters bodily contact, for use in controlling an external device110, such as a computer, television, video game, etc., based onmovements by the user detected by the sensors 16. In effect, thefootwear with the incorporated sensors 16 and leads 18 extending to auniversal port 14 allows the footwear to act as an input system, and theelectronic module 22 can be configured, programmed, and adapted toaccept the input from the sensors 16 and use this input data in anydesired manner, e.g., as a control input for a remote system. Forexample, a shoe with sensor controls could be used as a control or inputdevice for a computer, or for a program being executed by the computer,similarly to a mouse, where certain foot movements, gestures, etc.(e.g., a foot tap, double foot tap, heel tap, double heel tap,side-to-side foot movement, foot-point, foot-flex, etc.) can control apre-designated operation on a computer (e.g., page down, page up, undo,copy, cut, paste, save, close, etc.). Software can be provided to assignfoot gestures to different computer function controls for this purpose.It is contemplated that an operating system could be configured toreceive and recognize control input from the sensor system 12.Televisions or other external electronic devices can be controlled inthis manner. Footwear 100 incorporating the system 12 can also be usedin gaming applications and game programs, similarly to the Nintendo Wiicontroller, where specific movements can be assigned certain functionsand/or can be used to produce a virtual representation of the user'smotion on a display screen. As one example, center of pressure data andother weight distribution data can be used in gaming applications, whichmay involve virtual representations of balancing, weight shifting, andother performance activities. The system 12 can be used as an exclusivecontroller for a game or other computer system, or as a complementarycontroller. Examples of configurations and methods of using sensorsystems for articles of footwear as controls for external devices andfoot gestures for such controls are shown and described in U.S.Provisional Application No. 61/138,048, which is incorporated byreference herein in its entirety.

Additionally, the system 12 may be configured to communicate directlywith the external device 110 and/or with a controller for the externaldevice. As described above, FIG. 6 illustrates one embodiment forcommunication between the electronic module 22 and the external device.In another embodiment, shown in FIG. 23, the system 12 can be configuredfor communication with an external gaming device 110A. The externalgaming device 110A contains similar components to the exemplary externaldevice 110 shown in FIG. 6. The external gaming device 110A alsoincludes at least one game media 307 containing a game program (e.g. acartridge, CD, DVD, Blu-Ray, or other storage device), and at least oneremote controller 305 configured to communicate by wired and/or wirelessconnection through the transmitting/receiving element 108. In theembodiment shown, the controller 305 complements the user input 310,however in one embodiment, the controller 305 may function as the soleuser input. In this embodiment, the system 12 is provided with anaccessory device 303, such as a wireless transmitter/receiver with a USBplug-in, that is configured to be connected to the external device 110and/or the controller 305 to enable communication with the module 22. Inone embodiment, the accessory device 303 may be configured to beconnected to one or more additional controllers and/or external devices,of the same and/or different type than the controller 305 and theexternal device 110. It is understood that if the system 12 includesother types of sensors described above (e.g., an accelerometer), suchadditional sensors can also be incorporated into controlling a game orother program on an external device 110.

An external device 110, such as a computer/gaming system, can beprovided with other types of software to interact with the system 12.For example, a gaming program may be configured to alter the attributesof an in-game character based on a user's real-life activities, whichcan encourage exercise or greater activity by the user. In anotherexample, a program may be configured to display an avatar of the userthat acts in relation or proportion to the user activity collected bythe sensing system of the shoe. In such a configuration, the avatar mayappear excited, energetic, etc., if the user has been active, and theavatar may appear sleepy, lazy, etc., if the user has been inactive. Thesensor system 12 could also be configured for more elaborate sensing torecord data describing a “signature move” of an athlete, which couldthen be utilized for various purposes, such as in a gaming system ormodeling system.

A single article of footwear 100 containing the sensor system 12 asdescribed herein can be used alone or in combination with a secondarticle of footwear 100′ having its own sensor system 12′, such as apair of shoes 100, 100′ as illustrated in FIGS. 24-26. The sensor system12′ of the second shoe 100′ generally contains one or more sensors 16′connected by sensor leads 18′ to a port 14′ in communication with anelectronic module 22′. The second sensor system 12′ of the second shoe100′ shown in FIGS. 24-26 has the same configuration as the sensorsystem 12 of the first shoe 100. However, in another embodiment, theshoes 100, 100′ may have sensor systems 12, 12′ having differentconfigurations. The two shoes 100, 100′ are both configured forcommunication with the external device 110, and in the embodimentillustrated, each of the shoes 100, 100′ has an electronic module 22,22′ configured for communication with the external device 110. Inanother embodiment, both shoes 100, 100′ may have ports 14, 14′configured for communication with the same electronic module 22. In thisembodiment, at least one shoe 100, 100′ may be configured for wirelesscommunication with the module 22. FIGS. 24-26 illustrate various modesfor communication between the modules 22, 22′.

FIG. 24 illustrates a “mesh” communication mode, where the modules 22,22′ are configured for communicating with each other, and are alsoconfigured for independent communication with the external device 110.FIG. 25 illustrates a “daisy chain” communication mode, where one module22′ communicates with the external device 110 through the other module22. In other words, the second module 22′ is configured to communicatesignals (which may include data) to the first module 22, and the firstmodule 22 is configured to communicate signals from both modules 22, 22′to the external device 110. Likewise, the external device communicateswith the second module 22′ through the first module 22, by sendingsignals to the first module 22, which communicates the signals to thesecond module 22′. In one embodiment, the modules 22, 22′ can alsocommunicate with each other for purposes other than transmitting signalsto and from the external device 110. FIG. 26 illustrates an“independent” communication mode, where each module 22, 22′ isconfigured for independent communication with the external device 110,and the modules 22, 22′ are not configured for communication with eachother. In other embodiments, the sensor systems 12, 12′ may beconfigured for communication with each other and/or with the externaldevice 110 in another manner.

As will be appreciated by one of skill in the art upon reading thepresent disclosure, various aspects described herein may be embodied asa method, a data processing system, or a computer program product.Accordingly, those aspects may take the form of an entirely hardwareembodiment, an entirely software embodiment or an embodiment combiningsoftware and hardware aspects. Furthermore, such aspects may take theform of a computer program product stored by one or more tangiblecomputer-readable storage media or storage devices havingcomputer-readable program code, or instructions, embodied in or on thestorage media. Any suitable tangible computer readable storage media maybe utilized, including hard disks, CD-ROMs, optical storage devices,magnetic storage devices, and/or any combination thereof. In addition,various intangible signals representing data or events as describedherein may be transferred between a source and a destination in the formof electromagnetic waves traveling through signal-conducting media suchas metal wires, optical fibers, and/or wireless transmission media(e.g., air and/or space).

As described above, aspects of the present invention may be described inthe general context of computer-executable instructions, such as programmodules, being executed by a computer and/or a processor thereof.Generally, program modules include routines, programs, objects,components, data structures, etc. that perform particular tasks orimplement particular abstract data types. Such a program module may becontained in a tangible, non-transitory computer-readable medium, asdescribed above. Aspects of the present invention may also be practicedin distributed computing environments where tasks are performed byremote processing devices that are linked through a communicationsnetwork. Program modules may be located in a memory, such as the memory204 of the module 22 or memory 304 of the external device 110, or anexternal medium, such as game media 307, which may include both localand remote computer storage media including memory storage devices. Itis understood that the module 22, the external device 110, and/orexternal media may include complementary program modules for usetogether, such as in a particular application. It is also understoodthat a single processor 202, 302 and single memory 204, 304 are shownand described in the module 22 and the external device 110 for sake ofsimplicity, and that the processor 202, 302 and memory 204, 304 mayinclude a plurality of processors and/or memories respectively, and maycomprise a system of processors and/or memories.

The sensor system described herein can be utilized in a variety ofdifferent applications and configurations including general athleticperformance monitoring such as in fitness training or sport specificactivity such as basketball. It is understood that additional sensorscan be positioned at other locations on the footwear. The sensors in thesensor system can also be configured to sense specific lateral movementsand athletic cutting movements. As discussed herein, data collected bythe sensor system can be processed by the associated algorithms eitherin the electronic module, the mobile device or a remote site. It iscontemplated that such data processing can be used to advise usersregarding wear such that the user is advised when a new pair of shoes isneeded. Such data could also be processed and used to advise a user of aparticular type of shoe design that may be beneficial for the particularuser. Finally, the data can be processed to aid in the custom design offootwear. While the sensor system is shown in footwear, the system canbe used in other types of apparel.

The various embodiments of the sensor system described herein, as wellas the articles of footwear, foot contacting members, inserts, and otherstructures incorporating the sensor system, provide benefits andadvantages over existing technology. For example, many of the sensorembodiments described herein provide relatively low cost and durableoptions for sensor systems, so that a sensor system can be incorporatedinto articles of footwear with little added cost and good reliability.As a result, footwear can be manufactured with integral sensor systemsregardless of whether the sensor systems are ultimately desired to beused by the consumer, without appreciably affecting price. Additionally,sole inserts with customized sensor systems can be inexpensivelymanufactured and distributed along with software designed to utilize thesensor systems, without appreciably affecting the cost of the software.As another example, the sensor system provides a wide range offunctionality for a wide variety of applications, including gaming,fitness, athletic training and improvement, practical controls forcomputers and other devices, and many others described herein andrecognizable to those skilled in the art. In one embodiment, third-partysoftware developers can develop software configured to run using inputfrom the sensor systems, including games and other programs. The abilityof the sensor system to provide data in a universally readable formatgreatly expands the range of third party software and other applicationsfor which the sensor system can be used. Additionally, in oneembodiment, the sensor system can produce signals and data that permitaccurate detection of applied forces, which provides greater utility andversatility. As a further example, the various sole inserts containingsensor systems, including liners, insoles, and other elements, permitinterchangeability and customization of the sensor system for differentapplications. Other advantages are recognizable to those skilled in theart.

Several alternative embodiments and examples have been described andillustrated herein. A person of ordinary skill in the art wouldappreciate the features of the individual embodiments, and the possiblecombinations and variations of the components. A person of ordinaryskill in the art would further appreciate that any of the embodimentscould be provided in any combination with the other embodimentsdisclosed herein. It is understood that the invention may be embodied inother specific forms without departing from the spirit or centralcharacteristics thereof. The present examples and embodiments,therefore, are to be considered in all respects as illustrative and notrestrictive, and the invention is not to be limited to the details givenherein. The terms “first,” “second,” “top,” “bottom,” etc., as usedherein, are intended for illustrative purposes only and do not limit theembodiments in any way. Additionally, the term “plurality,” as usedherein, indicates any number greater than one, either disjunctively orconjunctively, as necessary, up to an infinite number. Further,“Providing” an article or apparatus, as used herein, refers broadly tomaking the article available or accessible for future actions to beperformed on the article, and does not connote that the party providingthe article has manufactured, produced, or supplied the article or thatthe party providing the article has ownership or control of the article.Accordingly, while specific embodiments have been illustrated anddescribed, numerous modifications come to mind without significantlydeparting from the spirit of the invention and the scope of protectionis only limited by the scope of the accompanying Claims.

What is claimed is:
 1. A sensor system comprising: an insert memberconfigured to be inserted into a foot-receiving chamber of an article offootwear, the insert member comprising a first layer and a second layer;a port connected to the insert and configured for communication with anelectronic module; a pathway providing electrical communication betweenthe first layer and the second layer; a plurality of sensors formed onthe insert member, each sensor comprising a first contact located on thefirst layer and a second contact located on the second layer, the secondcontact being generally aligned with the first contact, wherein thesensors are each configured such that pressure on the insert causesincreased engagement between the first and second contacts to change aresistance of the sensor; a plurality of leads located on the firstlayer and the second layer, the leads connecting the first contacts, thesecond contacts, the pathway, and the port; a first resistor located onthe first layer and connected to at least one of leads; and a secondresistor located on the second layer and connected at least one of theleads, wherein the port, the pathway, the sensors, the leads, and thefirst and second resistors form a circuit on the insert member, thecircuit configured to have a voltage applied between a first terminaland a ground located at the port, and wherein the first and secondresistors are arranged in parallel between the first terminal and theground, and wherein the insert member further comprises a spacer layerlocated between the first and second layers, the spacer layer havingholes aligned with the sensors to permit engagement of the first andsecond contacts of each sensor through the spacer layer.
 2. The sensorsystem of claim 1, the spacer layer having an additional hole thereinaligned with the pathway to permit electrical communication between thefirst and second layers through the pathway.
 3. The sensor system ofclaim 1, wherein the first resistor and the second resistor eachcomprise: an inner section connected to a first lead, an outer sectionconnected to a second lead, the outer section at least partiallysurrounding the inner section and being spaced from the inner section,and a bridge extending between the inner section and the outer sectionand partially overlapping both the inner section and the outer section,wherein the resistor is configured such that an electronic signal canpass between the first lead and the second lead through the innersection, the bridge, and the outer section.
 4. The sensor system ofclaim 3, wherein the outer sections of the first and second resistorseach comprise a first semi-annular ring that at least partiallysurrounds the inner section, and the bridges of the first and secondresistors each comprise a second semi-annular ring with an innersemi-circular edge and an outer semi-circular edge, wherein the inneredge of the bridge overlaps the inner section and the outer edge of thebridge overlaps the outer section.
 5. The sensor system of claim 4,wherein the inner and outer sections of the first and second resistorsare formed of a silver material, and the bridges of the first and secondresistors are formed of a carbon material.
 6. The sensor system of claim5, wherein the first and second contacts of each of the sensors areformed of the carbon material, and the plurality of leads are all formedof the silver material.
 7. The sensor system of claim 3, wherein thefirst lead of the first resistor and the first lead of the secondresistor are each connected to the pathway.
 8. The sensor system ofclaim 1, wherein the pathway comprises a first conductive portion on thefirst layer and a second conductive portion on the second layer, whereinthe first and second conductive portions are in continuous engagementwith each other to provide electrical communication between the firstand second layers, and wherein the first resistor is directly connectedto the first conductive portion by one of the leads and the secondresistor is directly connected to the second conductive portion byanother one of the leads.
 9. The sensor system of claim 1, wherein thecircuit further comprises a measurement terminal at the portelectrically connected between the first and second resistors combinedand each of the sensors and configured for measuring a voltage betweenthe measurement terminal and the ground, and wherein each of sensorsforms a voltage divider with the first and second resistors combined,such that a voltage between the first terminal and the ground is dividedbetween each sensor and the first and second resistors combined, and thevoltage between the measurement terminal and the ground changes as theresistance of each sensor changes.
 10. A sensor system comprising: aninsert member configured to be inserted into a foot-receiving chamber ofan article of footwear; a port connected to the insert and configuredfor communication with an electronic module; a plurality of sensorsformed on the insert member, each sensor configured for detectingpressure applied to the sensor; a plurality of leads located on theinsert and connecting the sensors to the port; and a resistor connectedto the sensors and the port by the leads, the resistor comprising: aninner section connected to a first lead, an outer section connected to asecond lead, the outer section substantially surrounding the innersection and being spaced from the inner section, and a bridge extendingbetween the inner section and the outer section and partiallyoverlapping both the inner section and the outer section, wherein theresistor is configured such that an electronic signal can pass betweenthe first lead and the second lead through the inner section, thebridge, and the outer section.
 11. The sensor system of claim 10,wherein the inner and outer sections are formed of a silver material,and the bridge is formed of a carbon material.
 12. The sensor system ofclaim 10, wherein the outer section comprises a first semi-annular ringthat at least partially surrounds the inner section, and the bridgecomprises a second semi-annular ring with an inner semi-circular edgeand an outer semi-circular edge, wherein the inner edge of the bridgeoverlaps the inner section and the outer edge of the bridge overlaps theouter section.
 13. The sensor system of claim 12, wherein the inner andouter sections are formed of a silver material, and the bridge is formedof a carbon material.
 14. The sensor system of claim 10, wherein theinsert comprises a first layer and a second layer, wherein the sensorseach comprise a first contact on the first layer and a second contact onthe second layer, each sensor configured to detect pressure byengagement between the first and second contacts, and wherein theresistor is located on the first layer and positioned between the firstcontacts of the sensors and the port, further comprising: a secondresistor located on the second layer and connected to the sensors andthe port by the leads, the second resistor comprising: a second innersection connected to a third lead, a second outer section connected to afourth lead, the second outer section substantially surrounding thesecond inner section and being spaced from the second inner section, anda second bridge extending between the second inner section and thesecond outer section and partially overlapping both the second innersection and the second outer section, wherein the second resistor isconfigured such that an electronic signal can pass between the thirdlead and the fourth lead through the second inner section, the secondbridge, and the second outer section.
 15. The sensor system of claim 14,wherein the port, the sensors, the leads, the resistor, and the secondresistor form a circuit on the insert member, the circuit configured tohave a voltage applied between a first terminal and a ground located atthe port, and wherein the resistor and the second resistor are arrangedin parallel between the first terminal and the ground.
 16. The sensorsystem of claim 15, wherein the circuit further comprises a measurementterminal at the port electrically connected between the first and secondresistors combined and each of the sensors and configured for measuringa voltage between the measurement terminal and the ground, and whereineach of sensors forms a voltage divider with the resistor and the secondresistor combined, such that a voltage between the first terminal andthe ground is divided between each sensor and the resistor and thesecond resistor combined, and the voltage between the measurementterminal and the ground changes as the resistance of each sensorchanges.
 17. A sensor system comprising: an insert member configured tobe inserted into a foot-receiving chamber of an article of footwear, theinsert member comprising a first layer, a second layer, and a spacerlayer located between the first and second layers; a port connected tothe insert and configured for communication with an electronic module; apathway providing electrical communication between the first layer andthe second layer, the spacer layer having a hole therein to permitelectrical communication between the first and second layers through thepathway; a plurality of sensors formed on the insert member, each sensorcomprising a first contact located on the first layer and a secondcontact located on the second layer, the second contact being generallyaligned with the first contact, wherein the sensors are each configuredsuch that pressure on the insert causes increased engagement between thefirst and second contacts to change a resistance of the sensor, whereinthe first and second contacts comprise a carbon material; a plurality ofleads located on the first layer and the second layer, the leadsconnecting the first contacts to the pathway, connecting the secondcontacts to the port, and connecting the port to the pathway, whereinthe leads comprise a silver material; a first resistor located on thefirst layer and connected to at least two of leads; and a secondresistor located on the second layer and connected at least two of theleads, wherein the first resistor and the second resistor each comprise:an inner section connected to first lead and comprising the silvermaterial; an outer section connected to a second lead and comprising thesilver material, the outer section substantially surrounding the innersection and being spaced from the inner section, and a bridge extendingbetween the inner section and the outer section and partiallyoverlapping both the inner section and the outer section, the bridgecomprising the carbon material, wherein the first and second resistorsare configured such that an electronic signal can pass between the firstlead and the second lead through the inner section, the bridge, and theouter section; and wherein the port, the pathway, the sensors, theleads, and the first and second resistors form a circuit on the insertmember, the circuit configured to have a voltage applied between a firstterminal and a ground located at the port, and wherein the first andsecond resistors are arranged in parallel between the first terminal andthe ground.
 18. The sensor system of claim 17, wherein the outersections of the first and second resistors each comprise a firstsemi-annular ring that at least partially surrounds the inner section,and the bridges of the first and second resistors each comprise a secondsemi-annular ring with an inner semi-circular edge and an outersemi-circular edge, wherein the inner edge of the bridge overlaps theinner section and the outer edge of the bridge overlaps the outersection.
 19. The sensor system of claim 18, wherein the first and secondsemi-annular rings have ends defining a gap therebetween, and the firstlead extends through the gap to pass away from the resistor withoutcontacting the outer section or the bridge.
 20. The sensor system ofclaim 17, wherein the pathway comprises a first conductive portion onthe first layer and a second conductive portion on the second layer,wherein the first and second conductive portions are in continuousengagement with each other to provide electrical communication betweenthe first and second layers, and wherein the first lead of the firstsensor is directly connected to the first conductive portion and thefirst lead of the second resistor is directly connected to the secondconductive portion.
 21. The sensor system of claim 17, wherein the firstresistor and the second resistor are arranged so that an electronicsignal from any of the sensors to the port must pass through at leastone of the first and second resistors.
 22. The sensor system of claim17, wherein the circuit further comprises a measurement terminal at theport electrically connected between the first and second resistorscombined and each of the sensors and configured for measuring a voltagebetween the measurement terminal and the ground, and wherein each ofsensors forms a voltage divider with the first and second resistorscombined, such that a voltage between the first terminal and the groundis divided between each sensor and the first and second resistorscombined, and the voltage between the measurement terminal and theground changes as the resistance of each sensor changes.
 23. A sensorsystem comprising: an insert member configured to be inserted into afoot-receiving chamber of an article of footwear, the insert membercomprising a first layer, a second layer, and a spacer layer locatedbetween the first and second layers; a port connected to the insert andconfigured for communication with an electronic module; a pathwayproviding electrical communication between the first layer and thesecond layer, wherein the spacer layer includes a hole located aroundthe pathway to permit the electrical communication between the first andsecond layers through the pathway; a plurality of sensors formed on theinsert member, each sensor comprising a first contact located on thefirst layer and a second contact located on the second layer, the secondcontact being generally aligned with the first contact, wherein thesensors are each configured such that pressure on the insert causesincreased engagement between the first and second contacts to changeresistance of the sensor; and a plurality of leads located on the firstlayer and the second layer, the leads connecting the first contacts tothe pathway, connecting the second contacts to the port, and connectingthe port to the pathway, wherein the pathway further comprises asubstantially annular stiffener positioned around the pathway on atleast one of the first and second layers, wherein the stiffener hasdecreased flexibility compared to the pathway.
 24. The system of claim23, wherein the pathway comprises a first conductive portion on thefirst layer and a second conductive portion on the second layer, whereinthe first and second conductive portions are in continuous engagementwith each other through the hole to provide electrical communicationbetween the first and second layers.
 25. The system of claim 24, furthercomprising: a first resistor located on the first layer and connected tothe first conductive portion by one or more leads; and a second resistorlocated on the second layer and connected to the second conductiveportion by one or more additional leads, wherein the port, the pathway,the sensors, the leads, and the first and second resistors form acircuit on the insert member, the circuit configured to have a voltageapplied between a first terminal and a ground located at the port, andwherein the first and second resistors are arranged in parallel betweenthe first terminal and the ground.
 26. The system of claim 23, whereinthe pathway comprises a first conductive portion on the first layer anda second conductive portion on the second layer, wherein the first andsecond conductive portions are in continuous engagement with each otherthrough the hole to provide electrical communication between the firstand second layers, and wherein the stiffener is located on the firstlayer and positioned around the first conductive portion, and thepathway further comprises a second substantially annular stiffenerlocated on the second layer and positioned around the second conductiveportion, wherein the second stiffener has decreased flexibility comparedto the pathway.
 27. The system of claim 26, wherein the hole in thespacer layer is larger than the first and second stiffeners, and whereinthe first and second layers deflect toward each other through the holeto be in continuous engagement with each other, such that the first andsecond stiffeners define a substantially annular transition region oneach of the first and second layers, wherein the first and second layersdeflect toward each other at the transition region and a majority of thefirst and second conductive portions are in engagement with each otherinside an area bounded by the transition region.
 28. The system of claim27, wherein the first and second conductive portions are in continuousengagement with each other through the hole over substantially anentirety of the area bounded by the transition region.
 29. The system ofclaim 27, wherein the transition region on each of the first and secondlayers is defined by an outer annular break line and an inner annularbreak line, with the transition region between the outer and inner breaklines and with the first and second conductive portions within the innerbreak line, wherein the first and second layers are generally horizontaloutside the outer break line and within the inner break line, and thefirst and second layers slope toward each other at the transitionregions to create engagement between the first and second conductiveportions.
 30. The system of claim 26, wherein the first and secondconductive portions each have a gap extending therethrough and dividingthe first and second conductive portions into separate first and secondsections, and wherein the gaps of the first and second conductiveportions are aligned such that the first section of the first conductiveportion engages the first section of the second conductive portion andthe second section of the first conductive portion engages the secondsection of the second conductive portion, with no direct engagementbetween the first sections and the second sections.
 31. The system ofclaim 30, wherein the first and second conductive portions are circularand the gaps extend across a diameter of each of the first and secondconductive portions, such that the first and second sections of each ofthe first and second conductive portions is semi-circular in shape. 32.A sensor system comprising: an insert member configured to be insertedinto a foot-receiving chamber of an article of footwear, the insertmember comprising a first layer, a second layer, and a spacer layerlocated between the first and second layers; a port connected to theinsert and configured for communication with an electronic module; apathway providing electrical communication between the first layer andthe second layer, wherein the spacer layer includes a hole locatedaround the pathway to permit the electrical communication between thefirst and second layers through the pathway, the pathway furthercomprising a substantially annular stiffener positioned around thepathway on at least one of the first and second layers, wherein thestiffener has decreased flexibility compared to the pathway; a pluralityof sensors formed on the insert member, each sensor comprising a firstcontact located on the first layer and a second contact located on thesecond layer, the sensor configured to sense pressure on the sensorthrough engagement between the first and second contacts; and aplurality of leads located on the first layer and the second layer, theleads connecting the first contacts and the second contacts to the portand to the pathway, wherein the pathway comprises a first conductiveportion on the first layer and a second conductive portion on the secondlayer, wherein the first and second conductive portions are incontinuous engagement with each other through the hole to provideelectrical communication between the first and second layers, andwherein the stiffener is located on the first layer and positionedaround the first conductive portion, and the pathway further comprises asecond substantially annular stiffener located on the second layer andpositioned around the second conductive portion, wherein the secondstiffener has decreased flexibility compared to the pathway, and whereinthe hole in the spacer layer is larger than the first and secondstiffeners, and wherein the first and second layers deflect toward eachother through the hole to be in continuous engagement with each other,such that the first and second stiffeners define a substantially annulartransition region on each of the first and second layers, wherein thefirst and second layers deflect toward each other at the transitionregion and a majority of the first and second conductive portions are inengagement with each other inside an area bounded by the transitionregion.
 33. The system of claim 32, wherein the transition region oneach of the first and second layers is defined by an outer annular breakline and an inner annular break line, with the transition region betweenthe outer and inner break lines and with the first and second conductiveportions within the inner break line, wherein the first and secondlayers are generally horizontal outside the outer break line and withinthe inner break line, and the first and second layers slope toward eachother at the transition regions to create engagement between the firstand second conductive portions.
 34. The system of claim 32, wherein thefirst and second conductive portions each have a gap extendingtherethrough and dividing the first and second conductive portions intoseparate first and second sections, and wherein the gaps of the firstand second conductive portions are aligned such that the first sectionof the first conductive portion engages the first section of the secondconductive portion and the second section of the first conductiveportion engages the second section of the second conductive portion,with no direct engagement between the first sections and the secondsections.
 35. The system of claim 34, wherein the first and secondconductive portions are circular and the gaps extend across a diameterof each of the first and second conductive portions, such that the firstand second sections of each of the first and second conductive portionsis semi-circular in shape.
 36. The system of claim 32, furthercomprising: a first resistor located on the first layer and connected tothe first conductive portion by one or more leads; and a second resistorlocated on the second layer and connected to the second conductiveportion by one or more additional leads, wherein the port, the pathway,the sensors, the leads, and the first and second resistors form acircuit on the insert member, the circuit configured to have a voltageapplied between a first terminal and a ground located at the port, andwherein the first and second resistors are arranged in parallel betweenthe first terminal and the ground.
 37. A sensor system comprising: aninsert member configured to be inserted into a foot-receiving chamber ofan article of footwear, the insert member comprising a first layer, asecond layer, and a spacer layer located between the first and secondlayers; a port connected to the insert and configured for communicationwith an electronic module; a plurality of sensors formed on the insertmember, each sensor comprising a first contact located on the firstlayer and a second contact located on the second layer, the sensorconfigured to sense pressure on the sensor through engagement betweenthe first and second contacts, wherein the plurality of sensorscomprises a first metatarsophalangeal sensor located in a positionconfigured to be directly beneath a first metatarsophalangeal joint of auser and a fourth metatarsophalangeal sensor located in a positionconfigured to be directly beneath a fourth metatarsophalangeal joint ofthe user; a pathway providing electrical communication between the firstlayer and the second layer, wherein the spacer layer includes a holelocated around the pathway to permit the electrical communicationbetween the first and second layers through the pathway, the pathwaybeing located in a position configured to be beneath at least one of asecond metatarsophalangeal joint and a third metatarsophalangeal jointof the user, the pathway further comprising a first conductive portionon the first layer and a second conductive portion on the second layer,wherein the first and second conductive portions are in continuousengagement with each other through the hole to provide electricalcommunication between the first and second layers, with the first andsecond conductive portions each having a gap extending therethrough anddividing the first and second conductive portions into separate firstand second sections, and wherein the gap is elongated and alignedsubstantially perpendicular to a virtual line extending between a frontedge of the first metatarsophalangeal sensor and a rear edge of thefourth metatarsophalangeal sensor; and a plurality of leads located onthe first layer and the second layer, the leads connecting the firstcontacts and the second contacts to the port and to the pathway.
 38. Thesystem of claim 37, further comprising: a first resistor located on thefirst layer and connected to the first conductive portion by one or moreleads; and a second resistor located on the second layer and connectedto the second conductive portion by one or more additional leads,wherein the port, the pathway, the sensors, the leads, and the first andsecond resistors form a circuit on the insert member, the circuitconfigured to have a voltage applied between a first terminal and aground located at the port, and wherein the first and second resistorsare arranged in parallel between the first terminal and the ground. 39.The system of claim 37, wherein the gaps of the first and secondconductive portions are aligned such that the first section of the firstconductive portion engages the first section of the second conductiveportion and the second section of the first conductive portion engagesthe second section of the second conductive portion, with no directengagement between the first sections and the second sections.
 40. Thesystem of claim 39, wherein the first and second conductive portions arecircular and the gaps extend across a diameter of each of the first andsecond conductive portions, such that the first and second sections ofeach of the first and second conductive portions is semi-circular inshape.
 41. The system of claim 37, the pathway further comprising afirst substantially annular stiffener located on the first layer andpositioned around the first conductive portion and a secondsubstantially annular stiffener located on the second layer andpositioned around the second conductive portion, wherein the first andsecond stiffeners have decreased flexibility compared to the pathway.42. The system of claim 41, wherein the hole in the spacer layer islarger than the first and second stiffeners, and wherein the first andsecond layers deflect toward each other through the hole to be incontinuous engagement with each other, such that the first and secondstiffeners define a substantially annular transition region on each ofthe first and second layers, wherein the first and second layers deflecttoward each other at the transition region and a majority of the firstand second conductive portions are in engagement with each other insidean area bounded by the transition region.
 43. A sensor systemcomprising: an insert member configured to be inserted into afoot-receiving chamber of an article of footwear, the insert membercomprising a first layer, a second layer, and a spacer layer locatedbetween the first and second layers; a port connected to the insert andconfigured for communication with an electronic module; a plurality ofsensors formed on the insert member, each sensor comprising a firstcontact located on the first layer and a second contact located on thesecond layer, the sensor configured to sense pressure on the sensorthrough engagement between the first and second contacts; a pathwayproviding electrical communication between the first layer and thesecond layer, wherein the spacer layer includes a hole located aroundthe pathway to permit the electrical communication between the first andsecond layers through the pathway, the pathway being located in aposition configured to be beneath at least one of a secondmetatarsophalangeal joint and a third metatarsophalangeal joint of theuser; and a plurality of leads located on the first layer and the secondlayer, the leads connecting the first contacts and the second contactsto the port and to the pathway.
 44. The system of claim 43, wherein thepathway comprises a first conductive portion on the first layer and asecond conductive portion on the second layer, wherein the first andsecond conductive portions are in continuous engagement with each otherthrough the hole to provide electrical communication between the firstand second layers.
 45. The system of claim 44, wherein the first andsecond conductive portions each have a gap extending therethrough anddividing the first and second conductive portions into separate firstand second sections, and wherein the gaps of the first and secondconductive portions are aligned such that the first section of the firstconductive portion engages the first section of the second conductiveportion and the second section of the first conductive portion engagesthe second section of the second conductive portion, with no directengagement between the first sections and the second sections.
 46. Thesystem of claim 44, further comprising: a first resistor located on thefirst layer and connected to the first conductive portion by one or moreleads; and a second resistor located on the second layer and connectedto the second conductive portion by one or more additional leads,wherein the port, the pathway, the sensors, the leads, and the first andsecond resistors form a circuit on the insert member, the circuitconfigured to have a voltage applied between a first terminal and aground located at the port, and wherein the first and second resistorsare arranged in parallel between the first terminal and the ground. 47.The system of claim 43, wherein the pathway further comprises asubstantially annular stiffener positioned around the pathway on atleast one of the first and second layers, wherein the stiffener hasdecreased flexibility compared to the pathway.
 48. The system of claim47, wherein the pathway comprises a first conductive portion on thefirst layer and a second conductive portion on the second layer, whereinthe first and second conductive portions are in continuous engagementwith each other through the hole to provide electrical communicationbetween the first and second layers, and wherein the stiffener islocated on the first layer and positioned around the first conductiveportion, and the pathway further comprises a second substantiallyannular stiffener located on the second layer and positioned around thesecond conductive portion, wherein the second stiffener has decreasedflexibility compared to the pathway.
 49. A sensor system comprising: aninsert member configured to be inserted into a foot-receiving chamber ofan article of footwear, the insert member comprising a first layer and asecond layer; a port connected to the insert and configured forcommunication with an electronic module; a pathway providing electricalcommunication between the first layer and the second layer; a pluralityof sensors formed on the insert member, each sensor comprising a firstcontact located on the first layer and a second contact located on thesecond layer, the second contact being generally aligned with the firstcontact, wherein the sensors are each configured such that pressure onthe insert causes increased engagement between the first and secondcontacts to change a resistance of the sensor; a plurality of leadslocated on the first layer and the second layer, the leads connectingthe first contacts, the second contacts, the pathway, and the port; afirst resistor located on the first layer and connected to at least oneof leads; and a second resistor located on the second layer andconnected at least one of the leads, wherein the port, the pathway, thesensors, the leads, and the first and second resistors form a circuit onthe insert member, the circuit configured to have a voltage appliedbetween a first terminal and a ground located at the port, and whereinthe first and second resistors are arranged in parallel between thefirst terminal and the ground, and wherein the first and second resistoreach comprise: an inner section connected to a first lead, an outersection connected to a second lead, the outer section at least partiallysurrounding the inner section and being spaced from the inner section,and a bridge extending between the inner section and the outer sectionand partially overlapping both the inner section and the outer section,wherein the resistor is configured such that an electronic signal canpass between the first lead and the second lead through the innersection, the bridge, and the outer section.
 50. The sensor system ofclaim 49, wherein the outer sections of the first and second resistorseach comprise a first semi-annular ring that at least partiallysurrounds the inner section, and the bridges of the first and secondresistors each comprise a second semi-annular ring with an innersemi-circular edge and an outer semi-circular edge, wherein the inneredge of the bridge overlaps the inner section and the outer edge of thebridge overlaps the outer section.
 51. The sensor system of claim 50,wherein the inner and outer sections of the first and second resistorsare formed of a silver material, and the bridges of the first and secondresistors are formed of a carbon material.
 52. The sensor system ofclaim 51, wherein the first and second contacts of each of the sensorsare formed of the carbon material, and the plurality of leads are allformed of the silver material.
 53. The sensor system of claim 49,wherein the first lead of the first resistor and the first lead of thesecond resistor are each connected to the pathway.
 54. A sensor systemcomprising: an insert member configured to be inserted into afoot-receiving chamber of an article of footwear, the insert membercomprising a first layer and a second layer; a port connected to theinsert and configured for communication with an electronic module; apathway providing electrical communication between the first layer andthe second layer; a plurality of sensors formed on the insert member,each sensor comprising a first contact located on the first layer and asecond contact located on the second layer, the second contact beinggenerally aligned with the first contact, wherein the sensors are eachconfigured such that pressure on the insert causes increased engagementbetween the first and second contacts to change a resistance of thesensor; a plurality of leads located on the first layer and the secondlayer, the leads connecting the first contacts, the second contacts, thepathway, and the port; a first resistor located on the first layer andconnected to at least one of leads; and a second resistor located on thesecond layer and connected at least one of the leads, wherein the port,the pathway, the sensors, the leads, and the first and second resistorsform a circuit on the insert member, the circuit configured to have avoltage applied between a first terminal and a ground located at theport, and wherein the first and second resistors are arranged inparallel between the first terminal and the ground, and wherein thecircuit further comprises a measurement terminal at the portelectrically connected between the first and second resistors combinedand each of the sensors and configured for measuring a voltage betweenthe measurement terminal and the ground, and wherein each of sensorsforms a voltage divider with the first and second resistors combined,such that a voltage between the first terminal and the ground is dividedbetween each sensor and the first and second resistors combined, and thevoltage between the measurement terminal and the ground changes as theresistance of each sensor changes.
 55. A sensor system comprising: aninsert member configured to be inserted into a foot-receiving chamber ofan article of footwear, the insert member comprising a first layer, asecond layer, and a spacer layer located between the first and secondlayers; a port connected to the insert and configured for communicationwith an electronic module; a pathway providing electrical communicationbetween the first layer and the second layer, wherein the spacer layerincludes a hole located around the pathway to permit the electricalcommunication between the first and second layers through the pathway,wherein the pathway comprises a first conductive portion on the firstlayer and a second conductive portion on the second layer, wherein thefirst and second conductive portions are in continuous engagement witheach other through the hole to provide electrical communication betweenthe first and second layers; a plurality of sensors formed on the insertmember, each sensor comprising a first contact located on the firstlayer and a second contact located on the second layer, the secondcontact being generally aligned with the first contact, wherein thesensors are each configured such that pressure on the insert causesincreased engagement between the first and second contacts to changeresistance of the sensor; a plurality of leads located on the firstlayer and the second layer, the leads connecting the first contacts tothe pathway, connecting the second contacts to the port, and connectingthe port to the pathway; a first resistor located on the first layer andconnected to the first conductive portion by one or more leads; and asecond resistor located on the second layer and connected to the secondconductive portion by one or more additional leads, wherein the port,the pathway, the sensors, the leads, and the first and second resistorsform a circuit on the insert member, the circuit configured to have avoltage applied between a first terminal and a ground located at theport, and wherein the first and second resistors are arranged inparallel between the first terminal and the ground.
 56. A sensor systemcomprising: an insert member configured to be inserted into afoot-receiving chamber of an article of footwear, the insert membercomprising a first layer, a second layer, and a spacer layer locatedbetween the first and second layers; a port connected to the insert andconfigured for communication with an electronic module; a pathwayproviding electrical communication between the first layer and thesecond layer, wherein the spacer layer includes a hole located aroundthe pathway to permit the electrical communication between the first andsecond layers through the pathway, the pathway further comprising asubstantially annular stiffener positioned around the pathway on atleast one of the first and second layers, wherein the stiffener hasdecreased flexibility compared to the pathway; a plurality of sensorsformed on the insert member, each sensor comprising a first contactlocated on the first layer and a second contact located on the secondlayer, the sensor configured to sense pressure on the sensor throughengagement between the first and second contacts; and a plurality ofleads located on the first layer and the second layer, the leadsconnecting the first contacts and the second contacts to the port and tothe pathway, wherein the pathway comprises a first conductive portion onthe first layer and a second conductive portion on the second layer,wherein the first and second conductive portions are in continuousengagement with each other through the hole to provide electricalcommunication between the first and second layers, and wherein thestiffener is located on the first layer and positioned around the firstconductive portion, and the pathway further comprises a secondsubstantially annular stiffener located on the second layer andpositioned around the second conductive portion, wherein the secondstiffener has decreased flexibility compared to the pathway, and whereinthe first and second conductive portions each have a gap extendingtherethrough and dividing the first and second conductive portions intoseparate first and second sections, and wherein the gaps of the firstand second conductive portions are aligned such that the first sectionof the first conductive portion engages the first section of the secondconductive portion and the second section of the first conductiveportion engages the second section of the second conductive portion,with no direct engagement between the first sections and the secondsections.
 57. The system of claim 56, wherein the first and secondconductive portions are circular and the gaps extend across a diameterof each of the first and second conductive portions, such that the firstand second sections of each of the first and second conductive portionsis semi-circular in shape.
 58. A sensor system comprising: an insertmember configured to be inserted into a foot-receiving chamber of anarticle of footwear, the insert member comprising a first layer, asecond layer, and a spacer layer located between the first and secondlayers; a port connected to the insert and configured for communicationwith an electronic module; a pathway providing electrical communicationbetween the first layer and the second layer, wherein the spacer layerincludes a hole located around the pathway to permit the electricalcommunication between the first and second layers through the pathway,the pathway further comprising a substantially annular stiffenerpositioned around the pathway on at least one of the first and secondlayers, wherein the stiffener has decreased flexibility compared to thepathway, wherein the pathway comprises a first conductive portion on thefirst layer and a second conductive portion on the second layer, whereinthe first and second conductive portions are in continuous engagementwith each other through the hole to provide electrical communicationbetween the first and second layers, and wherein the stiffener islocated on the first layer and positioned around the first conductiveportion, and the pathway further comprises a second substantiallyannular stiffener located on the second layer and positioned around thesecond conductive portion, wherein the second stiffener has decreasedflexibility compared to the pathway; a plurality of sensors formed onthe insert member, each sensor comprising a first contact located on thefirst layer and a second contact located on the second layer, the sensorconfigured to sense pressure on the sensor through engagement betweenthe first and second contacts; and a plurality of leads located on thefirst layer and the second layer, the leads connecting the firstcontacts and the second contacts to the port and to the pathway; a firstresistor located on the first layer and connected to the firstconductive portion by one or more leads; and a second resistor locatedon the second layer and connected to the second conductive portion byone or more additional leads, wherein the port, the pathway, thesensors, the leads, and the first and second resistors form a circuit onthe insert member, the circuit configured to have a voltage appliedbetween a first terminal and a ground located at the port, and whereinthe first and second resistors are arranged in parallel between thefirst terminal and the ground.